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  75757-1421 Datasheet PDF File

For 75757-1421 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    75757-1231

Molex Electronics Ltd.
Part No. 75757-1231
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4214-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-1362

Molex Electronics Ltd.
Part No. 75757-1362
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits

File Size 166.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4214-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    75757-1241

Molex Electronics Ltd.
Part No. 75757-1241
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 78511-421HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    75757-0431

Molex Electronics Ltd.
Part No. 75757-0431
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 99.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 68771-421HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
Tech specs    

Official Product Page

    75757-1322

Molex Electronics Ltd.
Part No. 75757-1322
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 0.75um (30u) Select Gold (Au) Plating

File Size 166.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 76314-213
Description Dubox® 2.54mm, Board to Board Connector, 26 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    75757-1332

Molex Electronics Ltd.
Part No. 75757-1332
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length

File Size 166.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    75757-1402

Molex Electronics Ltd.
Part No. 75757-1402
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length

File Size 166.38K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-1422

Molex Electronics Ltd.
Part No. 75757-1422
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4414-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-0432

Molex Electronics Ltd.
Part No. 75757-0432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 99.18K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6214-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-1432

Molex Electronics Ltd.
Part No. 75757-1432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7614-21D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 75757-1421 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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