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  75757-0242 Datasheet PDF File

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    75757-0431

Molex Electronics Ltd.
Part No. 75757-0431
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
File Size 99.18K  /  3 Page

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Amphenol Communications Solutions
Part No. 10127820-2421GPLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 24 Positions, GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    75757-1432

Molex Electronics Ltd.
Part No. 75757-1432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
File Size 166.45K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-2422LLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 24 Positions, LCP, GW Compatible, Tray Packing.
Tech specs 　 　

Official Product Page

    75757-1421

Molex Electronics Ltd.
Part No. 75757-1421
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.5um (60u) Tin (Sn) Plating
File Size 166.43K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-2422LCLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 24 Positions, LCP, GW Compatible, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    75757-0432

Molex Electronics Ltd.
Part No. 75757-0432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
File Size 99.18K  /  3 Page

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Amphenol Communications Solutions
Part No. 10127820-2421GLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 24 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    75757-0432

Molex Electronics Ltd.
Part No. 75757-0432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
File Size 99.27K  /  3 Page

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Amphenol Communications Solutions
Part No. 68002-425HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    http://
Part No. 75757-5461
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60u) Tin (Sn) Plating
File Size 166.20K  /  4 Page

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Amphenol Communications Solutions
Part No. 68024-215HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs 　 　

Official Product Page

    75757-5121

Molex Electronics Ltd.
Part No. 75757-5121
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail
File Size 166.21K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-2422GPLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 24 Positions, GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

    75757-0361

Molex Electronics Ltd.
Part No. 75757-0361
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
File Size 99.21K  /  3 Page

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Amphenol Communications Solutions
Part No. 68024-230HLF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Single Row, 30 Positions
Tech specs 　 　

Official Product Page

    75757-1422

Molex Electronics Ltd.
Part No. 75757-1422
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
File Size 166.45K  /  4 Page

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Amphenol Communications Solutions
Part No. 77313-102-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 42 Positions
Tech specs 　 　

Official Product Page

    75757-1431

Molex Electronics Ltd.
Part No. 75757-1431
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.5μm (60u) Tin (Sn) Plating
File Size 166.42K  /  4 Page

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Amphenol Communications Solutions
Part No. 68024-212HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs 　 　

Official Product Page

For 75757-0242 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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