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  74649-9004 Datasheet PDF File

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    0746492502 74649-2502

Molex Electronics Ltd.
Part No. 0746492502 74649-2502
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Open Module, 150Circuits, Pin Length 6.25mm (.246)
MOLEX Connector
File Size 454.49K  /  4 Page

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Amphenol Communications Solutions
Part No. 10115859-004LF
Description HPCE R/A REC 36P24S
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0746491007 74649-1007

Molex Electronics Ltd.
Part No. 0746491007 74649-1007
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Open Module, 80Circuits, Pin Length 6.25mm (.246)
File Size 454.37K  /  4 Page

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Amphenol Communications Solutions
Part No. 91269-004LF
Description Minitek® 2.00mm, Board to Board, Shrouded Header - Through Hole - Single row - 4 Positions - 2mm (0.079in) - Right Angle.
Tech specs 　 　

Official Product Page

    0746491104 74649-1104

Molex Electronics Ltd.
Part No. 0746491104 74649-1104
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Open End Version, Advanced Mate Shield, 80 Circuits
File Size 349.12K  /  4 Page

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Amphenol Communications Solutions
Part No. 87900-414HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    0746491004 74649-1004

Molex Electronics Ltd.
Part No. 0746491004 74649-1004
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Open Module, 80Circuits, Pin Length 5.15mm (.203)
File Size 454.37K  /  4 Page

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Amphenol Communications Solutions
Part No. 87900-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    0746491102 74649-1102

Molex Electronics Ltd.
Part No. 0746491102 74649-1102
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Open End Version, Advanced Mate Shield, 80 Circuits
File Size 349.11K  /  4 Page

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Amphenol Communications Solutions
Part No. 87900-454HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    0746491008 74649-1008

Molex Electronics Ltd.
Part No. 0746491008 74649-1008
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Open Module, 80 Circuits, Pin Length 4.25mm (.167)
File Size 454.37K  /  4 Page

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Amphenol Communications Solutions
Part No. 87900-402HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    0746491101 74649-1101

Molex Electronics Ltd.
Part No. 0746491101 74649-1101
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Open End Version, Advanced Mate Shield, 80 Circuits
File Size 349.11K  /  4 Page

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Amphenol Communications Solutions
Part No. 87900-422HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    0746491003 74649-1003

Molex Electronics Ltd.
Part No. 0746491003 74649-1003
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Open Module, 80 Circuits, Pin Length 4.25mm (.167)
File Size 454.37K  /  4 Page

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Amphenol Communications Solutions
Part No. 87900-442HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    0746491002 74649-1002

Molex Electronics Ltd.
Part No. 0746491002 74649-1002
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Open Module, 80Circuits, Pin Length 6.25mm (.246)
File Size 454.37K  /  4 Page

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Amphenol Communications Solutions
Part No. 87900-462HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    0746492501 74649-2501

Molex Electronics Ltd.
Part No. 0746492501 74649-2501
Description 2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Open Module, 150Circuits, Pin Length 4.75mm (.187)
MOLEX Connector
File Size 454.54K  /  4 Page

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Amphenol Communications Solutions
Part No. 10129378-909004BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Verticl Header, Through Hole, Single Row, 9 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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