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Rochester Electronics LLC |
| Part No. |
27C010-120DI
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| Description |
27C010 - 1024K (128K x 8) CMOS EPROM
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800145 15-80-0145 70567-0141
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
1,218.29K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10120818-001CLF
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| Description |
SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76350-120-22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 22 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93690-101-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800149 15-80-0149 A-70567-0277
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
75970-120-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,30 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800381 70567-0017 15-80-0381
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
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| File Size |
1,218.40K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68001-205HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 5 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51760-10401204AALF
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| Description |
PwrBlade®, Power Connectors, 4P 12S 4P Right Angle Receptacle, Solder To Board
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51701-10001202AALF
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| Description |
PwrBlade®, Power Supply Connectors, Vertical Header, With Guide Pin 12S 2P
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51762-10201200BALF
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| Description |
PwrBlade®, Power Connectors, 2P 12S Right Angle Receptacle, Solder To Board
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800181 70567-0007 A-70567-0007 15-80-0181
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
MOLEX Connector
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
51742-11301200AALF
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| Description |
PwrBlade®, Power Supply Connectors, 13P 12S Vertical Receptacle.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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