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  5850 Datasheet PDF File

For 5850 Found Datasheets File :: 95+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 |   

    BD95850F-LBE2

ROHM
Part No. BD95850F-LBE2
Description Earth Leakage Detector ICs

File Size 507.34K  /  22 Page

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Amphenol Communications Solutions

Part No. 86585-036LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    FE077A-A125850 FE077A-A/125850

ebm-papst
Part No. FE077A-A125850 FE077A-A/125850
Description AXIAL

File Size 290.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 86585-040LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs    

Official Product Page

    New Jersey Semi-Conductor Products, Inc.
New Jersey Semi-Conduct...
Part No. MJE5850 MJE5851 MJE5852
Description SWITCHMODE Series PNP Silicon Power Transistors
   SWITCHMODE Series PNP Silicon Power Transistors

File Size 110.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 86585-030LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs    

Official Product Page

    M65850 M65850FP M65850P

Mitsubishi Electric Corporation
Mitsubishi Electric Semiconductor
Part No. M65850 M65850FP M65850P
Description DIGITAL ECHO(DIGITAL DELAY)

File Size 69.54K  /  11 Page

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Amphenol Communications Solutions

Part No. 68585-006RLF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 20 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

    M65850FP M65850P

Renesas Electronics Corporation
Part No. M65850FP M65850P
Description Digital Echo (Digital Delay)

File Size 147.70K  /  12 Page

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Amphenol Communications Solutions

Part No. 86585-024LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs    

Official Product Page

    Renesas
Part No. M65850FP M65850P
Description ASSP>ICs for Audio Accessory>Karaoke Processors

File Size 3,964.07K  /  12 Page

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Amphenol Communications Solutions

Part No. 68585-011LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 30 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

    Sanyo
Part No. LC75850W LC75850E
Description CMOS IC

File Size 163.43K  /  11 Page

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Amphenol Communications Solutions

Part No. 75915-850HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    LC75850E LC75850W

SANYO[Sanyo Semicon Device]
Part No. LC75850E LC75850W
Description 1/3 Duty General Purpose LCD Drivers

File Size 199.17K  /  11 Page

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Amphenol Communications Solutions

Part No. 10139585-003LF
Description HPCE R/A Receptacle 8HP2LP24S
Tech specs    

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    IRF5850 IRF5850TR

International Rectifier
Part No. IRF5850 IRF5850TR
Description 2200 mA, 20 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET
-20V Dual P-Channel HEXFET Power MOSFET in a TSOP-6 package
Ultra Low On-Resistance

File Size 121.06K  /  9 Page

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Amphenol Communications Solutions

Part No. 75844-158-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TDA5850 Q67000-A1775

SIEMENS[Siemens Semiconductor Group]
Part No. TDA5850 Q67000-A1775
Description Video Switch/ Bipolar IC
Video Switch, Bipolar IC
Video Switch Bipolar IC

File Size 66.29K  /  3 Page

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Amphenol Communications Solutions

Part No. 68585-028LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 64 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

For 5850 Found Datasheets File :: 95+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 |   

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