| |
|
 |
Molex Electronics Ltd.
|
| Part No. |
0010897242 010-89-7242
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
| File Size |
421.76K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
972-402J-G0H
|
| Description |
XCede HD2, 4-Pair, 6 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
972-401E-G0H
|
| Description |
XCede HD2, 4-Pair, 6 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0010897240 010-89-7240
|
| Description |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail
|
| File Size |
421.78K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
972-402C-G0H
|
| Description |
XCede HD2, 4-Pair, 4 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
972-402E-G0H
|
| Description |
XCede HD2, 4-Pair, 8 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
972-401C-G0H
|
| Description |
XCede HD2, 4-Pair, 8 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
972-401J-G0H
|
| Description |
XCede HD2, 4-Pair, 4 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
67997-240HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
67997-242HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
67997-244HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
67997-246HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
