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  44474-1811 Datasheet PDF File

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    Agilent (Hewlett-Packard)
Part No. HBCR-1811 HBCR-1810
Description HBCR-1811 · Progammable Bar Code Decode ICs
HBCR-1810 · Progammable Bar Code Decode ICs
File Size 166.69K  /  12 Page

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Amphenol Communications Solutions
Part No. 131-8118-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    759-840-80-36-181 759-840-20-36-181 759-840-16-36-181 759-840-64-36-181 759-840-32-36-181 759-840-32-36-18110 759-840-08

Glenair, Inc.
Part No. 759-840-80-36-181 759-840-20-36-181 759-840-16-36-181 759-840-64-36-181 759-840-32-36-181 759-840-32-36-18110 759-840-08-36-181 759-840-24-36-181 759-840-40-36-181 759-840-96-36-181 759-840-48-36-181 759-840-12-36-181
Description Conduit Assembly
File Size 283.43K  /  2 Page

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Amphenol Communications Solutions
Part No. 131-8118-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    44474-1831 0444741831

Molex Electronics Ltd.
Part No. 44474-1831 0444741831
Description 4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB Lock, 18 Circuits, PA Polyamide Nylon 6/6 94V-2, with Drain Holes
File Size 328.69K  /  5 Page

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Amphenol Communications Solutions
Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    44474-0421 0444740421

Molex Electronics Ltd.
Part No. 44474-0421 0444740421
Description 4.20mm (.165") Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB
4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB
File Size 392.54K  /  6 Page

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Amphenol Communications Solutions
Part No. 68418-112HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs 　 　

Official Product Page

    44474-2411 0444742411

Molex Electronics Ltd.
Part No. 44474-2411 0444742411
Description 4.20mm (.165") Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in
4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in
File Size 328.69K  /  5 Page

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Amphenol Communications Solutions
Part No. 77315-118-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    44474-2421 0444742421

Molex Electronics Ltd.
Part No. 44474-2421 0444742421
Description 4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB Lock, 24 Circuits, PA Polyamide Nylon 6/6 94V-0, without Drain Holes
File Size 328.70K  /  5 Page

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Amphenol Communications Solutions
Part No. 77315-418-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    44474-2431 0444742431

Molex Electronics Ltd.
Part No. 44474-2431 0444742431
Description 4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB Lock, 24 Circuits, PA Polyamide Nylon 6/6 94V-2, with Drain Holes
File Size 328.70K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    44474-0411 0444740411

Molex Electronics Ltd.
Part No. 44474-0411 0444740411
Description 4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB Lock, 4 Circuits, PA Polyamide Nylon 6/6 94V-2, without Drain Holes
File Size 392.53K  /  6 Page

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Amphenol Communications Solutions
Part No. 131-5618-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    44474-1041 0444741041

Molex Electronics Ltd.
Part No. 44474-1041 0444741041
Description 4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB Lock, 10 Circuits, PA Polyamide Nylon 6/6 94V-0, with Drain Holes
File Size 328.70K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-7418-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    44474-1841 0444741841

Molex Electronics Ltd.
Part No. 44474-1841 0444741841
Description 4.20mm (.165") Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB Lock
4.20mm (.165) Pitch Mini-Fit HCS Header, Dual Row, Vertical, Blind Mating, with Snap-in Plastic Peg PCB Lock
File Size 328.70K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

For 44474-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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