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  44067-1602 Datasheet PDF File

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    0440672403 44067-2403

Molex Electronics Ltd.
Part No. 0440672403 44067-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 10127716-02LF
Description Minitek® Pwr 3.0, Dual Row, Receptacle Housing, 2 Positions, Non GW Compatible Nylon66, Black Color.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    44067-0201 0440670201

Molex Electronics Ltd.
Part No. 44067-0201 0440670201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.09K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-041602PLF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    44067-1603 0440671603

Molex Electronics Ltd.
Part No. 44067-1603 0440671603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 203.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 51741-10001602AALF
Description PwrBlade®, Power Supply Connectors, 16S 2P Vertical Receptacle.
Tech specs    

Official Product Page

    44067-0401 0440670401

Molex Electronics Ltd.
Part No. 44067-0401 0440670401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-121602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Tech specs    

Official Product Page

    44067-0402 0440670402

Molex Electronics Ltd.
Part No. 44067-0402 0440670402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 69916-024LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 56 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

    44067-0403 0440670403

Molex Electronics Ltd.
Part No. 44067-0403 0440670403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-101602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
Tech specs    

Official Product Page

    44067-1802 0440671802

Molex Electronics Ltd.
Part No. 44067-1802 0440671802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB

File Size 203.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 69916-022LF
Description BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 52 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
Tech specs    

Official Product Page

    44067-1801 0440671801

Molex Electronics Ltd.
Part No. 44067-1801 0440671801
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating

File Size 203.94K  /  3 Page

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Amphenol Communications Solutions

Part No. 71602-720LF
Description Quickie® IDC Receptacle, Wire To Board, Double Row, 20 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    44067-0601 0440670601

Molex Electronics Ltd.
Part No. 44067-0601 0440670601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 67016-024LF
Description Quickie®, Wire To Board, Strain Relief, 24 Positions
Tech specs    

Official Product Page

    44067-0603 0440670603

Molex Electronics Ltd.
Part No. 44067-0603 0440670603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. SE1416023111111
Description Slim Cool Edge 0.65mm, Surface mount, 4 power pins, 160 signal pins, Vertical
Tech specs    

Official Product Page

For 44067-1602 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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