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  43045-2413 Datasheet PDF File

For 43045-2413 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43045-1809

Molex Electronics Ltd.
Part No. 43045-1809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-1615

Molex Electronics Ltd.
Part No. 43045-1615
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Press-fit Metal Retention Clip, 16 Circuits
File Size 174.04K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1808

Molex Electronics Ltd.
Part No. 43045-1808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 68024-131HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs 　 　

Official Product Page

    43045-1807

Molex Electronics Ltd.
Part No. 43045-1807
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 68024-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs 　 　

Official Product Page

    43045-1806

Molex Electronics Ltd.
Part No. 43045-1806
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits
File Size 184.21K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-824-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1802

Molex Electronics Ltd.
Part No. 43045-1802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 68024-135HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs 　 　

Official Product Page

    43045-1801

Molex Electronics Ltd.
Part No. 43045-1801
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-124-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1800

Molex Electronics Ltd.
Part No. 43045-1800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-424-13LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-1209

Molex Electronics Ltd.
Part No. 43045-1209
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 12 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 93992-413HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 13 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1208

Molex Electronics Ltd.
Part No. 43045-1208
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 12 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. G881MA24132S1EU
Description Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Vertical, Dual row, 3.0mm pitch, 24 positions , 30u\\ Au, LCP, Black, REEL
Tech specs 　 　

Official Product Page

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