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  43045-0817 Datasheet PDF File

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    SSD0817 SSD0817Z

ETC
Part No. SSD0817 SSD0817Z
Description LCD SEGMENT / COMMON DRIVER WITH CONTROLLER
File Size 387.48K  /  43 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

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HUA FENG CIRCUIT





    Ericsson Microelectronics
ERICSSON[Ericsson]
Part No. PGE60817
Description EDFA Gain Block for DWDM Applications
File Size 284.60K  /  4 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    SJ108178

Japan Aviation Electronics Industry, Ltd.
Part No. SJ108178
Description FF084A1
File Size 253.66K  /  1 Page

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Amphenol Communications Solutions
Part No. 57102-S08-17LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions
Tech specs 　 　

Official Product Page

    SSD0817Z

List of Unclassifed Manufacturers
Part No. SSD0817Z
Description LCD Segment / Common Driver with Controller
File Size 396.08K  /  43 Page

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Amphenol Communications Solutions
Part No. 57102-F08-17LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
Tech specs 　 　

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    43045-0823

Molex Electronics Ltd.
Part No. 43045-0823
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row,
File Size 183.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 108-1711-100
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, Guide Module, With Post, No Key.
Tech specs 　 　

Official Product Page

    43045-0824

Molex Electronics Ltd.
Part No. 43045-0824
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.72K  /  3 Page

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Amphenol Communications Solutions
Part No. 59202-F40-08-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs 　 　

Official Product Page

    43045-0825

Molex Electronics Ltd.
Part No. 43045-0825
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.53K  /  3 Page

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Amphenol Communications Solutions
Part No. 54101-G0817LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0826

Molex Electronics Ltd.
Part No. 43045-0826
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits
File Size 182.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 54201-G0817LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-1809

Molex Electronics Ltd.
Part No. 43045-1809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 54102-T0817LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 34 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    43045-1624

Molex Electronics Ltd.
Part No. 43045-1624
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 16 Circuits
File Size 182.72K  /  3 Page

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Amphenol Communications Solutions
Part No. 54122-111081700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

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