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Molex Electronics Ltd.
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| Part No. |
30968-1208 0309681208
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 20 Circuits, Polarization Option #2, Black
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 20 Circuits, Polarization Option #2, Black
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| File Size |
300.98K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68461-127HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
30968-1168 0309681168
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #2, Black
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #2, Black
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| File Size |
300.97K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77317-112-70LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 70 Positions ,2.54mm (0.100in) Pitch,
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68031-127HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23in) Mating, 4.65 mm (0.183in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0309681129 30968-1129
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| Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #3, White
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #3, White
2.54mm (.100") Pitch, 0.64mm (.025") Width H-DAC 64垄芒 High Density AutomotiveCrimp Housing, Dual Row, 12 Circuits, Polarization Option #3, White
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| File Size |
301.14K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68001-127HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 27 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61127-5043LF
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| Description |
Header, Bottom Mount, Lower Deck(68Pins), VTB, 3.3V, 4.3mm s/o
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
UE86K112710321
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| Description |
SFP 2X1 WITH LIGHT PIPE
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-127-04LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-127-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-127-24LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77311-127-34LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Price and Availability
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