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  1331-183K Datasheet PDF File

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    NTE[NTE Electronics]
Part No. NTE1331
Description Integrated Circuit Module - Dual, Audio Power Amplifier, 25W/Channel, 2 Power Supplies Required
Integrated Circuit Module - Dual / Audio Power Amplifier / 25W/Channel / 2 Power Supplies Required

File Size 20.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 10118744-1133121LF
Description C - Commercial Series; Mezzanine Plug, SMT; 1mm Pitch; 4.15mm Mated Height, 21p
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SCH1331

Sanyo Semicon Device
Part No. SCH1331
Description General-Purpose Switching Device Applications
   General-Purpose Switching Device Applications

File Size 273.94K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3316-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    1-2013310-4

Tyco Electronics
Part No. 1-2013310-4
Description Memory Sockets; SEMI-HARD DDR3 204P 9.2H STD BOSSLESS ( Tyco Electronics )

File Size 357.66K  /  1 Page

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Amphenol Communications Solutions

Part No. 69133-118HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

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Part No. MSC1331
Description From old datasheet system

File Size 33.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 69133-144HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SCH1331 SCH1331-TL-H

ON Semiconductor
Part No. SCH1331 SCH1331-TL-H
Description P-Channel Power MOSFET 12V,3A, 84m Single SCH6
   P-Channel Power MOSFET 12V,3A, 84m Single SCH6

File Size 370.13K  /  7 Page

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Amphenol Communications Solutions

Part No. 69133-164HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1-2013311-6

Tyco Electronics
Part No. 1-2013311-6
Description Memory Sockets; SEMI-HARD TRAY DDR3 204P 9.2H RVS B-L076 ( Tyco Electronics )

File Size 1,378.59K  /  1 Page

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Amphenol Communications Solutions

Part No. 91910-21331LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 31 Positions, 1.00mm ( 0.039in) Pitch.
Tech specs    

Official Product Page

    TY Semiconductor Co., Ltd
Part No. AM1331P
Description Low rDS(on) provides higher efficiency

File Size 133.78K  /  2 Page

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Amphenol Communications Solutions

Part No. RJMG1331171C1ER
Description RJ Magnetic (RJMG) - Stacked, Input Output Connectors, 1 OVER SINGLE USB
Tech specs    

Official Product Page

    Solomon Systech
Part No. SSD1331
Description 96RGB x 64 Dot Matrix OLED/PLED Segment/Common Driver

File Size 1,022.06K  /  68 Page

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Amphenol Communications Solutions

Part No. 10118744-3133141LF
Description C - Commercial Series; Mezzanine Receptacle, SMT; 1mm Pitch; 41p
Tech specs    

Official Product Page

    TAI-SAW TECHNOLOGY CO.,...
Part No. TA1331A
Description SAW Filter 902.875 MHz

File Size 474.24K  /  7 Page

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Amphenol Communications Solutions

Part No. GSB3211331WEU
Description USB 3.2, Type B, Receptacle, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 2.8mm, Black Housing, Tray Packaging
Tech specs    

Official Product Page

    LRS1331

SHARP[Sharp Electrionic Components]
Part No. LRS1331
Description Stacked Chip 16M Flash Memory and 4M SRAM

File Size 213.86K  /  26 Page

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Amphenol Communications Solutions

Part No. 131-3316-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

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