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  1140-4129 Datasheet PDF File

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Part No. X24129SI-1.8
Description 75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF2807Z with Standard Packaging

File Size 433.96K  /  13 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TIP137 4129 TIP132 TIP135

STMICROELECTRONICS[STMicroelectronics]
Part No. TIP137 4129 TIP132 TIP135
Description COMPLEMENTARY SILICON POWER DARLINGTON TRANSISTORS
From old datasheet system

File Size 32.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-129-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

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    SAMSUNG[Samsung semiconductor]
Part No. KC74129C
Description 1/4 INCH CCD IMAGE SENSOR FOR PAL CAMERA

File Size 254.89K  /  20 Page

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Amphenol Communications Solutions

Part No. 68764-129HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 29 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. KC74129B
Description 1/4 INCH CCD IMAGE SENSOR FOR CCIR CAMERA

File Size 232.02K  /  18 Page

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Amphenol Communications Solutions

Part No. 68024-129HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

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    IEC-1140

Level One
Part No. IEC-1140
Description    10/100 Industrial Media Converter, SC SM 40KM

File Size 166.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 76314-129LF
Description Dubox® 2.54mm, Board to Board Connector, 58 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

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    1140-4032

Molex Electronics Ltd.
Part No. 1140-4032
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 68004-129HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

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    1140-4127

Molex Electronics Ltd.
Part No. 1140-4127
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-129-26LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

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    1140-4031

Molex Electronics Ltd.
Part No. 1140-4031
Description Conductor Punch

File Size 14.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-129-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. 21140-AE
Description LAN Node Controller

File Size 1,022.35K  /  55 Page

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Amphenol Communications Solutions

Part No. 85854-129LF
Description Metral® Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 4 Mod, Press Fit.
Tech specs    

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Part No. 21140-AF
Description 0 CHANNEL(S), 100M bps, LOCAL AREA NETWORK CONTROLLER, PQFP144

File Size 314.99K  /  55 Page

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Amphenol Communications Solutions

Part No. 93944-129HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 1140-4129 Found Datasheets File :: 150+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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