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  1140-2045 Datasheet PDF File

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    1140-4031

Molex Electronics Ltd.
Part No. 1140-4031
Description Conductor Punch
File Size 14.29K  /  1 Page

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Amphenol Communications Solutions
Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





   
Part No. 2045 2030
Description COMPRESSOR 14 CFM
File Size 94.84K  /  1 Page

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Amphenol Communications Solutions
Part No. 20021832-04510T1LF
Description Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 10 positions, 1.27mm (0.500in) pitch.
Tech specs 　 　

Official Product Page

    2045-40-B-T1LF 2045-09-B-T1LF 2045-13-B-T1LF 2045-35-B-T1LF 2045-12-B-T1LF 2045-07-B-T1LF 2045-25 2045-23-B-T1LF 2045-30

Bourns Electronic Solutions
Part No. 2045-40-B-T1LF 2045-09-B-T1LF 2045-13-B-T1LF 2045-35-B-T1LF 2045-12-B-T1LF 2045-07-B-T1LF 2045-25 2045-23-B-T1LF 2045-30-B-T1LF 2045-14 2045-14-B-T1LF 2045-25-B-T1LF 2045-47 2045-47-B-T1LF
Description 2045 Series Medium Duty 2-Electrode Gas Discharge Tube
File Size 235.15K  /  2 Page

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Amphenol Communications Solutions
Part No. 61082-204506LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

    ZX95-2045 ZX95-2045-S

Mini-Circuits
Part No. ZX95-2045 ZX95-2045-S
Description VCO, 1900 MHz - 2000 MHz ROHS COMPLIANT, CASE GB956
File Size 263.90K  /  2 Page

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Amphenol Communications Solutions
Part No. 68020-458HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 58 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    20456-3

RHOPOINT COMPONENTS
Part No. 20456-3
Description Heat flux sensor
File Size 92.65K  /  1 Page

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Amphenol Communications Solutions
Part No. 67292-045LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 90 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs 　 　

Official Product Page

    20457

RHOPOINT COMPONENTS
Part No. 20457
Description Heat flux sensor with integral thermocouple
File Size 91.21K  /  1 Page

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Amphenol Communications Solutions
Part No. 61083-204509LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

    1140-4017 0011-40-4017

Molex Electronics Ltd.
Part No. 1140-4017 0011-40-4017
Description Insulation Punch
File Size 14.44K  /  1 Page

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Amphenol Communications Solutions
Part No. 67292-045
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 90 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs 　 　

Official Product Page

    1140-4015 0011-40-4015

Molex Electronics Ltd.
Part No. 1140-4015 0011-40-4015
Description Insulation Punch
File Size 14.53K  /  1 Page

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Amphenol Communications Solutions
Part No. 61082-204502LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

    1140-4009 0011-40-4009

Molex Electronics Ltd.
Part No. 1140-4009 0011-40-4009
Description Insulation Punch
File Size 14.47K  /  1 Page

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Amphenol Communications Solutions
Part No. 68020-450HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    1140-4016 0011-40-4016

Molex Electronics Ltd.
Part No. 1140-4016 0011-40-4016
Description Conductor Punch
File Size 11.54K  /  1 Page

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Amphenol Communications Solutions
Part No. 61083-204502LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs 　 　

Official Product Page

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