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  1118-5061 Datasheet PDF File

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    PRECI-DIP SA
Part No. 1-1118-000-010
Description HANDLAMP EX HE8EURO HANDLAMP前HE8EURO

File Size 62.95K  /  1 Page

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Amphenol Communications Solutions

Part No. 10137925-0612LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 6 Positions, Non GW Compatible LCP, Tape and Reel. .
Tech specs    

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HUA FENG CIRCUIT





    1N5061 1N5062

Gulf Semiconductor
Part No. 1N5061 1N5062
Description Standard Recovery Pack: SOD-57
SINTERED GLASS JUNCTION AVALANCHE RECTIFIER VOLTAGE?00V to 800V CURRENT: 2.0A

File Size 61.83K  /  2 Page

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Amphenol Communications Solutions

Part No. G888005061THR
Description Board mount - Header Receptacle - Wire to Board 2.54mm Pitch Right Angle DIP,1x5Pin,Matte Tin,NY4T,Color-Black,Tray
Tech specs    

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    Digitron Semiconductors
Part No. 1N5062 1N5061
Description STANDARD AVALANCHE SINTERGLASS DIODE

File Size 64.65K  /  2 Page

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Amphenol Communications Solutions

Part No. 66506-119LF
Description Quickie Header, Wire to Board Connector, 4 wall, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

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    1118-4788 11-18-4788

Molex Electronics Ltd.
Part No. 1118-4788 11-18-4788
Description Barrel Form Anvil

File Size 19.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 10121506-160012BLF
Description HPCE STD VT Receptacle 16P12S
Tech specs    

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    1118-4997

Molex Electronics Ltd.
Part No. 1118-4997
Description Conductor Anvil

File Size 23.94K  /  1 Page

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Amphenol Communications Solutions

Part No. 447-5025-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    1118-4797 11-18-4797

Molex Electronics Ltd.
Part No. 1118-4797 11-18-4797
Description Conductor Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 460-5025-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row HSD, 25 positions, open, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    1118-4787 11-18-4787

Molex Electronics Ltd.
Part No. 1118-4787 11-18-4787
Description Conductor Punch

File Size 22.10K  /  1 Page

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Amphenol Communications Solutions

Part No. 467-5125-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 5 Row HSD, 25 positions, left, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    D1118

Fuji Electric
Part No. D1118
Description Search --To 2SD1118

File Size 130.76K  /  3 Page

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Amphenol Communications Solutions

Part No. 492-5025-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row HSD, 25 positions, right, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    1118-4799 11-18-4799

Molex Electronics Ltd.
Part No. 1118-4799 11-18-4799
Description Insulation Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 493-8025-061
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, open, adv mate, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

    1118-5073

Molex Electronics Ltd.
Part No. 1118-5073
Description Conductor Punch

File Size 22.14K  /  1 Page

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Amphenol Communications Solutions

Part No. 498-8025-061
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 25 positions, right, adv mate, 4.75mm (0.187in), Header.
Tech specs    

Official Product Page

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