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  sdram stacked 1gb d-die Datasheet PDF File

For sdram stacked 1gb d-die Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
Description 16M x 16 sdram, LVTTL, 133MHz
256Mb E-die sdram Specification 54pin sTSOP-II

File Size 205.22K  /  14 Page

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    STATSCHIP[STATS ChipPAC, Ltd.]
Part No. QFP-SD
Description stacked Die Quad Flat Pack

File Size 523.02K  /  2 Page

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    DSM390S2858CT1 M390S2858CT1 M390S2858CT1-C7A M390S2858CT1-C7C DS_M390S2858CT1

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. DSM390S2858CT1 M390S2858CT1 M390S2858CT1-C7A M390S2858CT1-C7C DS_M390S2858CT1
Description sdram DIMM sdram的内
128Mx72 sdram DIMM with PLL & Register based on stacked 128Mx4, 4Banks 8K Ref., 3.3V sdrams with SPD Data Sheet

File Size 238.33K  /  12 Page

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Part No. 1PK-3003D5 1PK-3003D15 1PK-3003D12 1PK-3003D10 1PK-3003D7 1PK-3003D3 1PK-3003D13 1PK-3003D6
Description DIE SET RG 58 RG 174
DIE SET RG 58 RG 59
DIE SET RG 59 RG 6
DIE SET RG 174 MINI RG 59
DIE SET INSULATED 板牙套装绝缘
DIE SET COAX CP88 CP89 板牙套装同轴CP88 CP89
DIE SET RJ11 DEC MMJ 板牙套装RJ112月MMJ
DIE SET N SERIES 板牙套装N系列

File Size 76.50K  /  1 Page

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    STATSCHIP[STATS ChipPAC, Ltd.]
Part No. FLGA-SD
Description Fine Pitch Land Grid Array - stacked Die

File Size 533.77K  /  2 Page

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    STATSCHIP[STATS ChipPAC, Ltd.]
Part No. FBGA-SD
Description Fine Pitch Ball Grid Array - stacked Die

File Size 555.83K  /  2 Page

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    408-8737

Tyco Electronics
Part No. 408-8737
Description The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw

File Size 117.59K  /  2 Page

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    K4S510732B K4S510732B-TC1H K4S510732B-TC1L K4S510732B-TC75 K4S510732B-TL1H K4S510732B-TL1L K4S510732B-TL75

Samsung semiconductor
Part No. K4S510732B K4S510732B-TC1H K4S510732B-TC1L K4S510732B-TC75 K4S510732B-TL1H K4S510732B-TL1L K4S510732B-TL75
Description stacked 512Mbit sdram

File Size 100.49K  /  11 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4S510732B-TC1L K4S510732B-TC1H K4S510732B-TL1L K4S510732B-TL1H K4S510732B-TL75
Description stacked 512Mbit sdram 堆积512兆内

File Size 106.16K  /  11 Page

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    Samsung Electronic
Part No. 128MX72sdramINTEL1.2VERBASE
Description 128Mx72 sdram DIMM with PLL & Register based on stacked 128Mx4, 4Banks 8K Ref., 3.3V sdrams with SPD Serial Presence Detec
128Mx72 sdram DIMM with PLL & Register based on stacked 128Mx4, 4Banks 8K Ref., 3.3V sdrams with SPD Data Sheet

File Size 68.27K  /  9 Page

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For sdram stacked 1gb d-die Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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