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  n-die Datasheet PDF File

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    Infineon Technologies
Part No. PEB2054-N
OCR Text ... Clearence SPC Visual Chip Test Die Attach Wire Bond Strength Process Audits Die Seperation Assembly, Wire Bonding, Vis. Examination before Encapsulation Visual Inspection of bonded Chips Assembly Lot Clearance SPC Sealing/Moldi...
Description Extended PCM Interface Controller-Small

File Size 3,037.36K  /  208 Page

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    SST39SF020-70-4C-N SST39SF020-70-4C-NH SST39SF020-70-4C-P SST39SF020-70-4C-PH SST39SF020-70-4C-U SST39SF020-70-4C-UH SST

SST[Silicon Storage Technology, Inc]
Part No. SST39SF020-70-4C-N SST39SF020-70-4C-NH SST39SF020-70-4C-P SST39SF020-70-4C-PH SST39SF020-70-4C-U SST39SF020-70-4C-UH SST39SF020-70-4C-W SST39SF020-70-4C-WH SST39SF020-70-4I-N SST39SF020-70-4I-NH SST39SF020-70-4I-P SST39SF020-70-4I-PH SST39SF020-70-4I-U SST39SF020-70-4I-UH SST39SF020-70-4I-W SST39SF020-70-4I-WH SST39SF020-90-4C-N SST39SF020-90-4C-NH SST39SF020-90-4C-P SST39SF020-90-4C-PH SST39SF020-90-4C-U SST39SF020-90-4C-UH SST39SF020-90-4C-W SST39SF020-90-4C-WH SST39SF020-90-4I-N SST39SF020-90-4I-NH SST39SF020-90-4I-P SST39SF020-90-4I-PH SST39SF020-90-4I-U SST39SF020-90-4I-UH SST39SF020-90-4I-W SST39SF020-90-4I-WH 39SF020
OCR Text ... modifier Package Type P = PDIP N = PLCC W = TSOP (die up) (8mm x 14mm) U = Unencapsulated die Temperature Range C = Commercial = 0 to 70C I = Industrial = -40 to 85C Minimum Endurance 4 = 10,000 cycles Read Access Speed 70 = 70 ns, 90 = 90...
Description 2 Megabit (256K x 8) Multi-Purpose Flash

File Size 225.95K  /  23 Page

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    MACOM[Tyco Electronics]
Part No. MAAPGM0063-DIE
OCR Text ...m. V GE_T GND:G VGB_T N: GDG N: GDG GDG G: N :N DG GDG :N GD: NG GD : NG G ND:G V D2 N: GD G GD: NG GD: NG GD: N...Die Layout. Bond Pad Dimensions Pad RF In and Out DC Drain Supply Voltage VDD DC Gate Supply Vol...
Description 8.5-11.0 GHZ, 5W Power Amplifier

File Size 365.03K  /  5 Page

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    DDTC114EE-DIE DDTA113ZE-DIE DCX100NS-7

Diodes Incorporated
Part No. DDTC114EE-DIE DDTA113ZE-DIE DCX100NS-7
OCR Text ...ise s pecified sub-component p /n reference device type r1 (nom) r2 (nom) r3, r4 (nom) figure ddta113ze_die q1 pnp 1k w 10k w ? 2 ddtc114ee_die q2 npn ? ? 10k w 2 l e a d - f r e e g r e e n t c u d o r p w e n ds30761 ...
Description 100mA DUAL COMPLEMENTARY PRE-BIASED TRANSISTORS

File Size 1,051.97K  /  7 Page

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    MACOM[Tyco Electronics]
Part No. MAPCGM0002-DIE
OCR Text ... GND:G 8 = 8 10 96 W= =i S n 18 Le = r r Le = S n 18 W= =i = 8 1096 8 W=8 S= 8 Len = 320 i r = 18 W=8 S=8 Len = 320 i r = 18 ...Die Layout Bond Pad Dimensions Pad RF In and Out DC Supply Voltage VEE DC Control Voltage VC Siz...
Description 3.5-6.0 GHz Phase Shifter

File Size 297.78K  /  7 Page

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