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Infineon Technologies
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| Part No. |
PEB2054-N
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| OCR Text |
... Clearence SPC Visual Chip Test Die Attach Wire Bond Strength
Process Audits
Die Seperation Assembly, Wire Bonding, Vis. Examination before Encapsulation
Visual Inspection of bonded Chips
Assembly Lot Clearance SPC Sealing/Moldi... |
| Description |
Extended PCM Interface Controller-Small
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| File Size |
3,037.36K /
208 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0063-DIE
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| OCR Text |
...m.
V GE_T
GND:G
VGB_T
N: GDG N: GDG GDG G: N :N DG GDG :N GD: NG GD : NG
G ND:G
V D2
N: GD G
GD: NG
GD: NG
GD: N...Die Layout.
Bond Pad Dimensions
Pad RF In and Out DC Drain Supply Voltage VDD DC Gate Supply Vol... |
| Description |
8.5-11.0 GHZ, 5W Power Amplifier
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| File Size |
365.03K /
5 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MAPCGM0002-DIE
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| OCR Text |
...
GND:G
8 = 8 10 96 W= =i S n 18 Le = r
r Le = S n 18 W= =i = 8 1096 8
W=8 S= 8 Len = 320 i r = 18
W=8 S=8 Len = 320 i r = 18
...Die Layout
Bond Pad Dimensions
Pad RF In and Out DC Supply Voltage VEE DC Control Voltage VC Siz... |
| Description |
3.5-6.0 GHz Phase Shifter
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| File Size |
297.78K /
7 Page |
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it Online |
Download Datasheet
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Price and Availability
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