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  CS03.0521.150 Datasheet PDF File

For CS03.0521.150 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    15-80-0521

Molex Electronics Ltd.
Part No. 15-80-0521
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, Tin (Sn) Plating

File Size 1,218.16K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-052141LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    NCS036-D002-K13289

Yamaichi Electronics Co., Ltd.
Part No. NCS036-D002-K13289
Description Dual Port - 90隆? Solder Dip Sockets
Dual Port - 90° Solder Dip Sockets

File Size 51.79K  /  1 Page

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Amphenol Communications Solutions

Part No. 10137784-05212LF
Description Minitek® Pwr 4.2 HCC, Single Row, Right Angle Through Hole Header, Nylon 66, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, Tray packing.
Tech specs    

Official Product Page

    GEP-0521

Level One
Part No. GEP-0521
Description IEEE 802.3af/at PoE compliant to simplify deployment and installation 10/100/1000Mbps wire speed transmission and reception

File Size 503.66K  /  5 Page

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Amphenol Communications Solutions

Part No. 59453-052110ECHLF
Description 0.50mm Flex Connectors, FPC/FFC Side Entry ZIF Connector, Surface Mount, 5 Positions, Top Contact, 0.50mm (0.020in) Pitch.
Tech specs    

Official Product Page

    Coilcraft, Inc.
Part No. GS84032T-166 GS84032T-166I GS84032B-166I GS84032B-166IT GS84032B-180T GS84018T-180 GS84032T-180 GS84036T-180 GS84036T-180T GS84018/32/36T/B-180/166/150/100 GS84032T-180T GS84036T-166IT
Description x32 Fast Synchronous SRAM
x36 Fast Synchronous SRAM
256K x 18 128K x 32 128K x 36 4Mb Sync Burst
x18 Fast Synchronous SRAM x18快速同步SRAM

File Size 708.39K  /  31 Page

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Amphenol Communications Solutions

Part No. 10130521-101LF
Description AirMax VSe®, Backplane Connectors, 4-Pair, 72 -position, 2mm pitch, 6 column, Vertical Header, small press-fit, 2 side plating, with cover.
Tech specs    

Official Product Page

    AS8F2M32Q-120_IT AS8F2M32Q-120_MIL AS8F2M32Q-120_XT AS8F2M32QW-120_IT AS8F2M32QW-120_MIL AS8F2M32QW-120_XT AS8F2M32QW-15

Austin Semiconductor
Part No. AS8F2M32Q-120_IT AS8F2M32Q-120_MIL AS8F2M32Q-120_XT AS8F2M32QW-120_IT AS8F2M32QW-120_MIL AS8F2M32QW-120_XT AS8F2M32QW-150_IT AS8F2M32QW-150_MIL AS8F2M32QW-150_XT AS8F2M32QW-90_IT AS8F2M32QW-90_MIL AS8F2M32QW-90_XT AS8F2M32Q-150_IT AS8F2M32Q-150_MIL AS8F2M32Q-150_XT AS8F2M32 AS8F2M32Q-90_IT AS8F2M32Q-90_MIL AS8F2M32Q-90_XT AS8F2M32Q-90/IT AS8F2M32Q-90/MIL AS8F2M32Q-90/XT AS8F2M32QW-120/IT AS8F2M32QW-120/MIL AS8F2M32QW-120/XT AS8F2M32QW-150/IT AS8F2M32QW-150/MIL AS8F2M32QW-150/XT AS8F2M32Q-120/IT AS8F2M32Q-120/MIL AS8F2M32Q-120/XT AS8F2M32QW-90/IT AS8F2M32QW-90/MIL AS8F2M32QW-90/XT AS8F2M32Q-150/MIL AS8F2M32Q-150/IT AS8F2M32Q-150/XT
Description 2M x 32 FLASH FLASH MEMORY MODULE

File Size 373.73K  /  12 Page

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Amphenol Communications Solutions

Part No. 87052-106HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 6 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    CECS03XV0-G

Comchip Technology
Part No. CECS03XV0-G
Description Bidirectional ESD / Transient Suppressor

File Size 172.21K  /  2 Page

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Amphenol Communications Solutions

Part No. 87052-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    Intersil, Corp.
Part No. ACS03KMSR
Description Logic IC 逻辑IC

File Size 96.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 87052-150HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    Intersil, Corp.
Part No. ACS03DMSR
Description Quad 2-Input NAND Gate with Open Drain; Temperature Range: -; Package: 14-SBDIP AC SERIES, QUAD 2-INPUT NAND GATE, CDIP14

File Size 198.17K  /  6 Page

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Amphenol Communications Solutions

Part No. 87052-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    Visual Communications Compa...
Part No. LCS032RTP
Description 5MM THREADED MOISTURE SEALED LITEPIPE

File Size 77.74K  /  1 Page

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Amphenol Communications Solutions

Part No. 98426-S12-05-210LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    AMIS-30521

ON Semiconductor
Part No. AMIS-30521
Description Micro-Stepping Motor Driver

File Size 278.88K  /  28 Page

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Amphenol Communications Solutions

Part No. 10132798-052130LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 50 position, 2.7mm height receptacle connector.
Tech specs    

Official Product Page

For CS03.0521.150 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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