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  boron Datasheet PDF File

For boron Found Datasheets File :: 32    Search Time::2.735ms    
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    Comus Group of Companies
Part No. M1219-2
OCR Text ...ting temperature Neodymium Iron boron (NdFeB) Nickel plated 0.95 2500 Grade N30H, max. energy density 30 MGOe 120C max. NdFeb is a high energy material with exceptional resistance to de-magnetisation. MAGNET Rev. No. Revision Note Da...
Description Communications, Neodymium Iron boron (NdFeB) Nickel plated Magnet

File Size 8.09K  /  1 Page

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    GDSGA0-500E GDSGA0-700E GDSGA0-900E GDSGA0-B00E

Rectron Semiconductor
Part No. GDSGA0-500E GDSGA0-700E GDSGA0-900E GDSGA0-B00E
OCR Text ... FEATURES * Silicon chip with boron / Phosphorus dopants * Solderable metallization Ni / Au * Glass passivated junction RATINGS Maximum Recurrent Peak Reverse Voltage Maximum Average Forward Rectified Current at Derating Case Temperatu...
Description STANDARD GPP CHIP - 100MIL

File Size 130.10K  /  2 Page

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    Renesas
Part No. MFI341S2500
OCR Text ...00020 0.0001 0.0005 dopant chip boron 7440-42-8 c040001 0.000409 0.0012 0.0100 dopant et.al. chip phosphorus 7723-14-0 c050003 0.001023 0.0029 0.0250 dopant et.al. chip copper 7440-50-8 c160001 0.000123 0.0004 0.0030 wiring material chip al...
Description Combined

File Size 1,086.66K  /  27 Page

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    441-PRS21001-12 144-PRS13095-12 400-PRM20001-12 LM20005-12 289-PLM17001-12 225-PRM17008-12 400-PLS20001-12

Aries Electronics, Inc.
ARIES ELECTRONICS INC
Part No. 441-PRS21001-12 144-PRS13095-12 400-PRM20001-12 LM20005-12 289-PLM17001-12 225-PRM17008-12 400-PLS20001-12
OCR Text ...n tail over nickel 6 = nickel boron (spinodal) pin only consult factory for minimum ordering quantities as well as availability of this pin solder tail pin footprint number many pga footprints are available and listed by footprint number ...
Description ZIF PGA SOCKET 441 PIN 21 X 21 PGA441, IC SOCKET
PGA144, IC SOCKET
PGA400, IC SOCKET
PGA256, IC SOCKET
PGA289, IC SOCKET
PGA225, IC SOCKET

File Size 16,568.00K  /  15 Page

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    2N4427 2N3866

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 2N4427 2N3866
OCR Text ...top clamping washer 56218 and a boron nitride washer for electrical insulation. 1995 Oct 27 3 Philips Semiconductors Product specification Silicon planar epitaxial overlay transistors 2N3866; 2N4427 MGC589 handbook, ...
Description Silicon planar epitaxial overlay transistors

File Size 41.16K  /  9 Page

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    GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E

Rectron Semiconductor
Part No. GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E
OCR Text ... FEATURES * Silicon chip with boron / Phosphorus dopants * Solderable metallization Ni / Au * Glass passivated junction RATINGS Maximum Recurrent Peak Reverse Voltage Maximum Average Forward Rectified Current at Derating Case Temperatu...
Description STANDARD GPP CHIP - 70MIL

File Size 130.83K  /  2 Page

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    AN11010

NXP Semiconductors
Part No. AN11010
OCR Text ... the base layer suppresses the boron diffusion during wafer processing. this allows steeper and narrower sige hbt base and a heavier doped base. as a result, lower base resistance, lower noise and higher cut off frequency can be achieved...
Description Single stage Ku band LNA using BFU730F

File Size 908.95K  /  20 Page

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    P3911

ETAL Group
Part No. P3911
OCR Text ...using the virata beryllium and boron chipsets. p3911 is certified to safety standards iec 950 and ul 60950 for supplementary insulation, 250v working voltage. p3911 is a ul recognized component and is supported by an iec cb test cer...
Description ADSL Transformer

File Size 122.78K  /  4 Page

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    Laird Technologies, Inc.
Part No. BR1458S/D
OCR Text ... p+ source drain dopant boron (bf2) metallization processing metal composition alsicu w/tin barrier (m1) alsicu (m2) passivation processing passivation type double layer, nitride over psg oxide ...
Description Reliability Report for the LCX Product Family 可靠性报告的回旋支产品系

File Size 168.97K  /  16 Page

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For boron Found Datasheets File :: 32    Search Time::2.735ms    
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