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  90136-2218 Datasheet PDF File

For 90136-2218 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90136-2102

Molex Electronics Ltd.
Part No. 90136-2102
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218AFG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-1325

Molex Electronics Ltd.
Part No. 90136-1325
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.22K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218AFNG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    90136-2212

Molex Electronics Ltd.
Part No. 90136-2212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218FTG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    90136-1205

Molex Electronics Ltd.
Part No. 90136-1205
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218FG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    90136-1202

Molex Electronics Ltd.
Part No. 90136-1202
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218FNG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    90136-1206

Molex Electronics Ltd.
Part No. 90136-1206
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TB62218AFTG
Description Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Phase Interface
Tech specs    

Official Product Page

    90136-2108

Molex Electronics Ltd.
Part No. 90136-2108
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90136-2210

Molex Electronics Ltd.
Part No. 90136-2210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 254.60K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-2325

Molex Electronics Ltd.
Part No. 90136-2325
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 25 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2322

Molex Electronics Ltd.
Part No. 90136-2322
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.34K  /  5 Page

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Amphenol Communications Solutions

Part No. 77313-122-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 18 Positions
Tech specs    

Official Product Page

For 90136-2218 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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