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  90136-1310 Datasheet PDF File

For 90136-1310 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90136-2232

Molex Electronics Ltd.
Part No. 90136-2232
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2312

Molex Electronics Ltd.
Part No. 90136-2312
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-2215

Molex Electronics Ltd.
Part No. 90136-2215
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 15 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2218

Molex Electronics Ltd.
Part No. 90136-2218
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 77313-103-10LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
Tech specs    

Official Product Page

    90136-1325

Molex Electronics Ltd.
Part No. 90136-1325
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-102-56LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 56 Positions
Tech specs    

Official Product Page

    90136-2212

Molex Electronics Ltd.
Part No. 90136-2212
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 10106268-0013101LF
Description PwrBlade+® , Power Connectors, 52S STB, Vertical, Receptacle.
Tech specs    

Official Product Page

    90136-1205

Molex Electronics Ltd.
Part No. 90136-1205
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-103-06LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Double Row, 6 Positions
Tech specs    

Official Product Page

    90136-1202

Molex Electronics Ltd.
Part No. 90136-1202
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-102-24LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
Tech specs    

Official Product Page

    90136-2109

Molex Electronics Ltd.
Part No. 90136-2109
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 9 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 77313-101-72LF
Description BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions
Tech specs    

Official Product Page

    90136-2210

Molex Electronics Ltd.
Part No. 90136-2210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 254.60K  /  5 Page

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Amphenol Communications Solutions

Part No. 77313-102-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 42 Positions
Tech specs    

Official Product Page

For 90136-1310 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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