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  90136-1109 Datasheet PDF File

For 90136-1109 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90136-2106

Molex Electronics Ltd.
Part No. 90136-2106
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2105

Molex Electronics Ltd.
Part No. 90136-2105
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-2104

Molex Electronics Ltd.
Part No. 90136-2104
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2103

Molex Electronics Ltd.
Part No. 90136-2103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    90136-2102

Molex Electronics Ltd.
Part No. 90136-2102
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 85674-1109LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body, 1 Mod.
Tech specs    

Official Product Page

    90136-2310

Molex Electronics Ltd.
Part No. 90136-2310
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.44K  /  5 Page

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Amphenol Communications Solutions

Part No. 68001-109HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 9 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2109

Molex Electronics Ltd.
Part No. 90136-2109
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 9 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.53K  /  5 Page

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Amphenol Communications Solutions

Part No. 54121-109051650LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2125

Molex Electronics Ltd.
Part No. 90136-2125
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 68461-109HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
Tech specs    

Official Product Page

    90136-2210

Molex Electronics Ltd.
Part No. 90136-2210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 254.60K  /  5 Page

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Amphenol Communications Solutions

Part No. 78511-109HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90136-2115

Molex Electronics Ltd.
Part No. 90136-2115
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 15 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 162.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 91932-31109LF
Description Conan® 1.00mm Connector, Board to Board connector, I - Industrial Series, Vertical Receptacle, Surface Mount, 9 Positions, 1.00mm ( 0.039in) Pitch.
Tech specs    

Official Product Page

For 90136-1109 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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