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  90130-1106 Datasheet PDF File

For 90130-1106 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90130-3334

Molex Electronics Ltd.
Part No. 90130-3334
Description
File Size 168.26K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

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HUA FENG CIRCUIT





    90130-3140

Molex Electronics Ltd.
Part No. 90130-3140
Description 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)

File Size 168.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    90130-3324

Molex Electronics Ltd.
Part No. 90130-3324
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    90130-3326

Molex Electronics Ltd.
Part No. 90130-3326
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating

File Size 168.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    190130

OSA Opto Light GmbH
Part No. 190130
Description GaAlAs / GaAs LED Chips

File Size 47.92K  /  1 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 90130-1138 90130-1238 90130-1112 90130-1124 90130-1118 90130-1110
Description C-Grid Shrd Hdr DR Vt Sn-A 38/38 38 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
C-Grid Shrd Hdr DR Vt Au-E 38/38 38 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; Number of Contacts:12; Pitch Spacing:2.54mm; Number of Rows:2; Series:C-Grid III; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Straight Pin 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; Number of Contacts:24; Pitch Spacing:2.54mm; Number of Rows:2; Series:C-Grid III; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Straight Pin 24 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; Number of Contacts:18; Pitch Spacing:2.54mm; Number of Rows:2; Series:C-Grid III; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Straight Pin 18 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CONN HEADER 10POS .100 STR TIN 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 172.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

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Part No. 1106-16
Description
File Size 54.73K  /  1 Page

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Amphenol Communications Solutions

Part No. G832MB110603222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 60 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

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Part No. 1106
Description From old datasheet system

File Size 323.50K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MB110642122HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 4.7 mm, 64 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs    

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    CEP-1106

CUI INC,
Part No. CEP-1106
Description piezo audio transducer

File Size 395.49K  /  5 Page

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Amphenol Communications Solutions

Part No. 10027011-106HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Surface Mount, Single Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

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    Advanced Thermal Soluti...
Part No. ATS-1106-C1-R0
Description Heat Sink for Half Brick DC-DC Converter

File Size 362.27K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-106041200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 90130-1106 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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