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NXP Semiconductors N.V.
Elektron Technology PLC
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| Part No. |
PS06/B0630/2815 PS06/A0330/2815 PS06/A0130/2815 PS07/B1032/6300 PS06/A0132/2830
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| Description |
6A, 250VAC, MALE, MAINS POWER CONNECTOR, SOLDER
3A, 250VAC, MALE, MAINS POWER CONNECTOR, SOLDER
1A, 250VAC, MALE, MAINS POWER CONNECTOR, SOLDER
10A, 250VAC, MALE, MAINS POWER CONNECTOR, SOLDER
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| File Size |
602.29K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-107281500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59202-T28-15A062LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJMG1S1128151ER
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| Description |
RJMG, Input output Connectors, 2x2 10/100 with leds
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143016 87914-3016
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77315-428-15LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions 2.54mm (0.100in) Pitch, Right Angle
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-3616 0879143616
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
59202-G28-15-060LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
59202-H28-15A060LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
TPS2815DR
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| Description |
Two input NAND, Dual High-Speed MOSFET Drivers 8-SOIC -40 to 125
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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