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2415S E005202 AT54A MB89715P 000WD UG1003 V123H TES2N08
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  87911-3011 Datasheet PDF File

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    87911-1611 0879111611

Molex Electronics Ltd.
Part No. 87911-1611 0879111611
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 16 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free

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Amphenol Communications Solutions

Part No. 76345-301-16LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0879111011 87911-1011

Molex Electronics Ltd.
Part No. 0879111011 87911-1011
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX Connector

File Size 361.19K  /  6 Page

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Amphenol Communications Solutions

Part No. 70430-116LF
Description Metral® Power Connectors, Backplane Power Connectors, 5 Row Power Header,Vertical Press-Fit, Wide body.
Tech specs    

Official Product Page

    0879115011 87911-5011

Molex Electronics Ltd.
Part No. 0879115011 87911-5011
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
MOLEX Connector

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Amphenol Communications Solutions

Part No. 54202-S3011LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 22 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87911-5811 0879115811

Molex Electronics Ltd.
Part No. 87911-5811 0879115811
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131930-116ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 16 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    87911-2411 0879112411

Molex Electronics Ltd.
Part No. 87911-2411 0879112411
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-107301100LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87911-2211 0879112211

Molex Electronics Ltd.
Part No. 87911-2211 0879112211
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free

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Amphenol Communications Solutions

Part No. 59112-G30-11A067
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 22 Positions.
Tech specs    

Official Product Page

    87911-2011 0879112011

Molex Electronics Ltd.
Part No. 87911-2011 0879112011
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 59202-G30-11A075LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Stacking Header - Surface Mount - Double row - 22 Positions - 2mm (0.079inch) - Vertical.
Tech specs    

Official Product Page

    87911-0611 0879110611

Molex Electronics Ltd.
Part No. 87911-0611 0879110611
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-11108LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 8 Positions
Tech specs    

Official Product Page

    87911-0411 0879110411

Molex Electronics Ltd.
Part No. 87911-0411 0879110411
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 4 Circuits, 0.38μm Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-11111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    87911-1811 0879111811

Molex Electronics Ltd.
Part No. 87911-1811 0879111811
Description 2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 18 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free

File Size 360.87K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-11113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

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