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  87834-4013 Datasheet PDF File

For 87834-4013 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87834-2419

Molex Electronics Ltd.
Part No. 87834-2419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 24 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC4013BP
Description CMOS Logic IC, D-Type Flip-Flop, DIP14
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-2411

Molex Electronics Ltd.
Part No. 87834-2411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 24 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. ME1014013401311
Description Mini Cool Edge 0.60mm,Storage and Server connector ,Gen Z,EDSFF,OCP 3.0,140 signal pins, SMT, OCP, Straddle mount, 1.93mmPCB,-0.3mm offset
Tech specs    

Official Product Page

    87834-2421

Molex Electronics Ltd.
Part No. 87834-2421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 77315-401-35LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    87834-2611

Molex Electronics Ltd.
Part No. 87834-2611
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 26 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 77317-401-36LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 36 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    87834-1419

Molex Electronics Ltd.
Part No. 87834-1419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 14 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-401-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-2641

Molex Electronics Ltd.
Part No. 87834-2641
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. G832MC030401322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 3.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold White.
Tech specs    

Official Product Page

    87834-1611

Molex Electronics Ltd.
Part No. 87834-1611
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 16 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10044013-10110TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, 280 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    87834-2695

Molex Electronics Ltd.
Part No. 87834-2695
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-401-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 36 Positions
Tech specs    

Official Product Page

    87834-2619

Molex Electronics Ltd.
Part No. 87834-2619
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 26 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 10118940-134LF
Description Active Latch Housing Type II, Double Row, 34 Position
Tech specs    

Official Product Page

    87834-4143

Molex Electronics Ltd.
Part No. 87834-4143
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator

File Size 93.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-401-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 87834-4013 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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