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  87832-0808 Datasheet PDF File

For 87832-0808 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87832-3222

Molex Electronics Ltd.
Part No. 87832-3222
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 32 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap,

File Size 367.55K  /  6 Page

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Amphenol Communications Solutions

Part No. 54242-808081200LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 8 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87832-1614

Molex Electronics Ltd.
Part No. 87832-1614
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.80K  /  5 Page

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Amphenol Communications Solutions

Part No. 54242-808081350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-1616

Molex Electronics Ltd.
Part No. 87832-1616
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.79K  /  5 Page

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Amphenol Communications Solutions

Part No. 54242-108081600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-7122

Molex Electronics Ltd.
Part No. 87832-7122
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 44 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 367.67K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-408081250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87832-7123

Molex Electronics Ltd.
Part No. 87832-7123
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 44 Circuits, 0.76μm (30μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 386.42K  /  6 Page

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Amphenol Communications Solutions

Part No. 54201-T0808LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87832-1620

Molex Electronics Ltd.
Part No. 87832-1620
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.52K  /  6 Page

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Amphenol Communications Solutions

Part No. 54122-408081300LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87832-4221

Molex Electronics Ltd.
Part No. 87832-4221
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 42 Circuits, 0.76μm (30μ) Gold (Au) Plating

File Size 386.26K  /  6 Page

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Amphenol Communications Solutions

Part No. 10142708-08000LF
Description Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 8 Positions, 30u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
Tech specs    

Official Product Page

    87832-1412

Molex Electronics Ltd.
Part No. 87832-1412
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 14 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 349.89K  /  5 Page

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Amphenol Communications Solutions

Part No. 54202-G0808AB07LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87832-4220

Molex Electronics Ltd.
Part No. 87832-4220
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree 42 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.53K  /  6 Page

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Amphenol Communications Solutions

Part No. 10125394-T0808ALF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87832-5822

Molex Electronics Ltd.
Part No. 87832-5822
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, Shrouded, Leadfree, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cap

File Size 367.66K  /  6 Page

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Amphenol Communications Solutions

Part No. 54201-G0808PA05LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87832-0808 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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