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  87759-3815 Datasheet PDF File

For 87759-3815 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-4215

Molex Electronics Ltd.
Part No. 87759-4215
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 59112-T38-15-135LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 30 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3864

Molex Electronics Ltd.
Part No. 87759-3864
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging

File Size 420.91K  /  8 Page

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Amphenol Communications Solutions

Part No. 77313-815-72LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions
Tech specs    

Official Product Page

    87759-1250

Molex Electronics Ltd.
Part No. 87759-1250
Description
File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 59202-G38-15P144LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
Tech specs    

Official Product Page

    87759-4465

Molex Electronics Ltd.
Part No. 87759-4465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 77313-815-06LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions
Tech specs    

Official Product Page

    87759-4014

Molex Electronics Ltd.
Part No. 87759-4014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 563.47K  /  11 Page

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Amphenol Communications Solutions

Part No. 59202-G38-15A139LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 30 Positions.
Tech specs    

Official Product Page

    87759-4464

Molex Electronics Ltd.
Part No. 87759-4464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 44 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 421.15K  /  8 Page

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    87759-3014

Molex Electronics Ltd.
Part No. 87759-3014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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    87759-4015

Molex Electronics Ltd.
Part No. 87759-4015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 383.21K  /  9 Page

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    87759-4065

Molex Electronics Ltd.
Part No. 87759-4065
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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    87759-4665

Molex Electronics Ltd.
Part No. 87759-4665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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