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  87758-4616 Datasheet PDF File

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    87758-3450

Molex Electronics Ltd.
Part No. 87758-3450
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 34 Circuits, 0.38um (15u) Gold (Au) Selective Plating
File Size 135.48K  /  4 Page

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Texas Instruments
Part No. 5962-87758012A
Description Octal Bus Transceivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    87758-1650

Molex Electronics Ltd.
Part No. 87758-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
File Size 135.76K  /  4 Page

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Texas Instruments
Part No. 5962-8775801RA
Description Octal Bus Transceivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87758-3017

Molex Electronics Ltd.
Part No. 87758-3017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.47K  /  4 Page

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Texas Instruments
Part No. 5962-8775801VSA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87758-3850

Molex Electronics Ltd.
Part No. 87758-3850
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
File Size 135.48K  /  4 Page

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Texas Instruments
Part No. 5962-8775801SA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87758-3617

Molex Electronics Ltd.
Part No. 87758-3617
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 77311-846-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    87758-2417

Molex Electronics Ltd.
Part No. 87758-2417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

    87758-3050

Molex Electronics Ltd.
Part No. 87758-3050
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 30 Circuits
File Size 135.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 77311-146-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    87758-2216

Molex Electronics Ltd.
Part No. 87758-2216
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.38um (15u) Gold (Au) Selective Plating
File Size 170.71K  /  4 Page

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Amphenol Communications Solutions
Part No. 77313-846-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
Tech specs 　 　

Official Product Page

    87758-2416

Molex Electronics Ltd.
Part No. 87758-2416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.38μm 15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.71K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4616-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    87758-1850

Molex Electronics Ltd.
Part No. 87758-1850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits
File Size 135.97K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-4616-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

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