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  87758-1416 Datasheet PDF File

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    87758-2450

Molex Electronics Ltd.
Part No. 87758-2450
Description 2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits
File Size 135.77K  /  4 Page

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Texas Instruments
Part No. 5962-87758012A
Description Octal Bus Transceivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    87758-1616

Molex Electronics Ltd.
Part No. 87758-1616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38um (15u) Gold (Au) Selective Plating
File Size 170.71K  /  4 Page

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Texas Instruments
Part No. 5962-8775801RA
Description Octal Bus Transceivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87758-2016

Molex Electronics Ltd.
Part No. 87758-2016
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.71K  /  4 Page

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Texas Instruments
Part No. 5962-8775801VSA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87758-1417

Molex Electronics Ltd.
Part No. 87758-1417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 14 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.75K  /  4 Page

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Texas Instruments
Part No. 5962-8775801SA
Description Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87758-1617

Molex Electronics Ltd.
Part No. 87758-1617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 89891-416HLF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 32 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    87758-1650

Molex Electronics Ltd.
Part No. 87758-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
File Size 135.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 78511-416HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    87758-2050

Molex Electronics Ltd.
Part No. 87758-2050
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits
File Size 135.92K  /  4 Page

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Amphenol Communications Solutions
Part No. 94611-416HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87758-1816

Molex Electronics Ltd.
Part No. 87758-1816
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.71K  /  4 Page

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Amphenol Communications Solutions
Part No. 77314-168LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    87758-1817

Molex Electronics Ltd.
Part No. 87758-1817
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.70K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-416063050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87758-2017

Molex Electronics Ltd.
Part No. 87758-2017
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 68481-416HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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