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  76135-8501 Datasheet PDF File

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    HARWIN
Part No. H8501-XX
Description 0.8mm SOCKET ASSEMBLY
File Size 91.69K  /  1 Page

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Amphenol Communications Solutions
Part No. 91276-135HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs 　 　

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HUA FENG CIRCUIT





    A8501

Allegro MicroSystems
Part No. A8501
Description 2 MHz, 4 Channel100 mA WLED/RGB Driver
File Size 576.75K  /  24 Page

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Amphenol Communications Solutions
Part No. 95278-501-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    ST Microelectronics
Part No. DB-85015-940
Description RF power amplifier using 1 x PD85015-E N-channel enhancement-mode lateral MOSFETs
File Size 505.71K  /  14 Page

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Amphenol Communications Solutions
Part No. 95278-501-46LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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Part No. LAS-8501P
Description 6 A HALF BRIDGE BASED PRPHL DRVR, PSFM5
File Size 254.02K  /  8 Page

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Amphenol Communications Solutions
Part No. 95278-501A16LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    85013-9028

Molex Electronics Ltd.
Part No. 85013-9028
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, 3-Row C-Pin, Style R Male
File Size 74.09K  /  3 Page

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Amphenol Communications Solutions
Part No. 95278-501A40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    85013-0361

Molex Electronics Ltd.
Part No. 85013-0361
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R Reverse,0.6um (24u) Selective Gold (Au), 32 Circuits
File Size 118.42K  /  5 Page

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Amphenol Communications Solutions
Part No. 95278-501B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    85015-0311

Molex Electronics Ltd.
Part No. 85015-0311
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Press-fit Style R, 0.6μm (24μ) Gold (Au), 128 Circuit, Lead Free
File Size 72.04K  /  3 Page

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Amphenol Communications Solutions
Part No. 95278-501B40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

Official Product Page

    85013-1512

Molex Electronics Ltd.
Part No. 85013-1512
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 96 Circuits, Flux Proof Option Available
File Size 126.00K  /  5 Page

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Amphenol Communications Solutions
Part No. RJCSE508501
Description Modular Jack - Right Angle, Input Output Connectors 8P8C, Without Shield, With LEDs.
Tech specs 　 　

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    85015-0165

Molex Electronics Ltd.
Part No. 85015-0165
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, Vertical, Through Hole
File Size 67.40K  /  3 Page

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Amphenol Communications Solutions
Part No. 468-5010-061
Description VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row HSD, 10 positions, open, 4.75mm (0.187in), Header.
Tech specs 　 　

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    85013-2385

Molex Electronics Ltd.
Part No. 85013-2385
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free
File Size 113.29K  /  5 Page

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Amphenol Communications Solutions
Part No. 498-5010-A62
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 6 Row VHDM, 10 positions, right, A-Key, 6.25mm (0.246in), Header.
Tech specs 　 　

Official Product Page

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