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  75757-1421 Datasheet PDF File

For 75757-1421 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    75757-5161

Molex Electronics Ltd.
Part No. 75757-5161
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4214-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-5101

Molex Electronics Ltd.
Part No. 75757-5101
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4214-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

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Part No. 75757-5461
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60u) Tin (Sn) Plating

File Size 166.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 78511-421HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

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Part No. 75757-5431
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 68771-421HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
Tech specs    

Official Product Page

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Part No. 75757-5421
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 76314-213
Description Dubox® 2.54mm, Board to Board Connector, 26 Positions,Double Row,Vertical,2.54mm pitch,Card Connector.
Tech specs    

Official Product Page

    http://
Part No. 75757-5401
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    75757-1481

Molex Electronics Ltd.
Part No. 75757-1481
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-1382

Molex Electronics Ltd.
Part No. 75757-1382
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 0.75μm(30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187)

File Size 166.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4414-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-5281

Molex Electronics Ltd.
Part No. 75757-5281
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 158.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6214-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-1431

Molex Electronics Ltd.
Part No. 75757-1431
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.5μm (60u) Tin (Sn) Plating

File Size 166.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7614-21D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

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