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  71764-0322 Datasheet PDF File

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    71764-0120

Molex Electronics Ltd.
Part No. 71764-0120
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 10137785-032221LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 3 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0118

Molex Electronics Ltd.
Part No. 71764-0118
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 120.86K  /  5 Page

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Amphenol Communications Solutions

Part No. 10112690-T03-22ULF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Surface Mount - Double row - 44 Positions - 2mm (0.079inch) - Horizontal
Tech specs    

Official Product Page

    71764-0104

Molex Electronics Ltd.
Part No. 71764-0104
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.22K  /  5 Page

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Amphenol Communications Solutions

Part No. 10137784-03224LF
Description Minitek® Pwr 4.2 HCC, Single Row, Right Angle Through Hole Header, LCP, Gold Flash plating, Black Color, 3 Positions, Non GW Compatible, Tray packing.
Tech specs    

Official Product Page

    71764-0116

Molex Electronics Ltd.
Part No. 71764-0116
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.10K  /  5 Page

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Amphenol Communications Solutions

Part No. 10136644-0322LF
Description Minitek® Pwr 4.2 , Single Row, Receptacle Housing, 3 Positions, Non GW Compatible Nylon66, Black Color.
Tech specs    

Official Product Page

    71764-0114

Molex Electronics Ltd.
Part No. 71764-0114
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.23K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MC110403222HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 5.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

Official Product Page

    71764-0108

Molex Electronics Ltd.
Part No. 71764-0108
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.01K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MB111003222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 100ΩPositions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

Official Product Page

    71764-0106

Molex Electronics Ltd.
Part No. 71764-0106
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MB110603222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 60 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

Official Product Page

    71764-0226

Molex Electronics Ltd.
Part No. 71764-0226
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MB110403222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 40 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold Black.
Tech specs    

Official Product Page

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 88903-223LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 2 Mod
Tech specs    

Official Product Page

    71764-0222

Molex Electronics Ltd.
Part No. 71764-0222
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 88903-221LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 2 Mod
Tech specs    

Official Product Page

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