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  71308-0116 Datasheet PDF File

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    71308-6456

Molex Electronics Ltd.
Part No. 71308-6456
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 56 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 76345-301-16LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71308-6458

Molex Electronics Ltd.
Part No. 71308-6458
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 58 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 10116658-152FSLF
Description DDR2 SO-DIMM, Storage and Server Connector, Right Angle, Surface Mount, 200 Position, Standard Type, 0.60mm (0.024in) Pitch
Tech specs    

Official Product Page

    71308-6460

Molex Electronics Ltd.
Part No. 71308-6460
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 60 Circuits, 1.50um (59u) Minimum

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 70430-116LF
Description Metral® Power Connectors, Backplane Power Connectors, 5 Row Power Header,Vertical Press-Fit, Wide body.
Tech specs    

Official Product Page

    71308-6462

Molex Electronics Ltd.
Part No. 71308-6462
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 62 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 20021521-00116C1LF
Description Minitek127®, Shrouded Board to Board Header, Surface Mount, 16 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    71308-6464

Molex Electronics Ltd.
Part No. 71308-6464
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 64 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 77313-801-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
Tech specs    

Official Product Page

    71308-6468

Molex Electronics Ltd.
Part No. 71308-6468
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 68 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 95293-401-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71308-5474

Molex Electronics Ltd.
Part No. 71308-5474
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10116951-4030LF
Description CXP Passive Copper Cable Assemblies, Passive, 10Gb/s, 26 AWG, 3.0m, non-halogen free
Tech specs    

Official Product Page

    71308-5478

Molex Electronics Ltd.
Part No. 71308-5478
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 78 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10116951-2010HLF
Description CXP Passive Copper Cable Assemblies, Passive, 10Gb/s, 30 AWG, 1.0m, Halogen free
Tech specs    

Official Product Page

    71308-5480

Molex Electronics Ltd.
Part No. 71308-5480
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 80 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 80 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 87901-164HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 64 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    71308-0038

Molex Electronics Ltd.
Part No. 71308-0038
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 38 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 27.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 10131930-116ULF
Description Minitek®, Board to Board, Receptacle, Through Mount, Single row, 16 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

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