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  70567-0137 Datasheet PDF File

For 70567-0137 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    14-60-0137

Molex Electronics Ltd.
Part No. 14-60-0137
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 3.81μm (150μ) Tin/Lead (SnPb)

File Size 159.94K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137785-051131LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    70567-0013 A-70567-0013 15-80-0301

Molex Electronics Ltd.
Part No. 70567-0013 A-70567-0013 15-80-0301
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-031222LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    A-70567-0014 15-80-0321

Molex Electronics Ltd.
Part No. A-70567-0014 15-80-0321
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating

File Size 1,218.23K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-032221LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 3 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    70567-0016 A-70567-0016 15-81-0361

Molex Electronics Ltd.
Part No. 70567-0016 A-70567-0016 15-81-0361
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating

File Size 1,218.45K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-052141LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    70567-0143 15-80-0185

Molex Electronics Ltd.
Part No. 70567-0143 15-80-0185
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-052221LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    A-70567-0364 15-80-1521

Molex Electronics Ltd.
Part No. A-70567-0364 15-80-1521
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137785-031242LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 3 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    Winchester Electronics ...
Part No. 01370
Description LOW PROFILE THRU HOLE SOCKET

File Size 64.05K  /  1 Page

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Amphenol Communications Solutions

Part No. 10137785-042222LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 4 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    SI-50137

Bel Fuse Inc.
Part No. SI-50137
Description SI-50137

File Size 394.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137785-051241LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Black Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

    BEL[Bel Fuse Inc.]
Part No. SI-60137-F
Description SI-60137-F

File Size 265.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137785-041132LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 4 Positions, GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    DAICO[DAICO Industries, Inc.]
Part No. DS0137
Description DAICO Switches SPST, SP7T
PIN Diode SP7T

File Size 23.87K  /  1 Page

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Amphenol Communications Solutions

Part No. 10137785-031141LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 3 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs    

Official Product Page

For 70567-0137 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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