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Amphenol Communications Solutions |
| Part No. |
10150526-1011HLF
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| Description |
2.0MM WIRE TO BOARD HEADER
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1971
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 19 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 19 CircuitsLead-free, High Barrier Packaging
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| File Size |
504.02K /
9 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
85261-001LF
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| Description |
Din Accessory Locking Frame 3x16
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1572
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 15 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 15 Circuits, Lead-free, High Barrier Packaging
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| File Size |
523.95K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54121-109051650LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1471
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 14 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 14 CircuitsLead-free, High Barrier Packaging
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| File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
93690-105-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1372
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 13 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 13 Circuits, Lead-free, High Barrier Packaging
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| File Size |
523.95K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE051661410H
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| Description |
Modular Jack - Right Angle, Input Output Connectors 6P6C, Shield, High Temperature.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1171
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 11 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 11 CircuitsLead-free, High Barrier Packaging
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| File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
90516-026
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Right Angled Header,Through Hole, Double Row, 44 Positions, 2.00mm (0.079in) Pitch..
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1172
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, Gold (Au)Contact Plating, 11 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, Gold (Au)Contact Plating, 11 Circuits, Lead-free, High Barrier Packaging
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| File Size |
523.93K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68405-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
52610-1272
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) Contact Plating, 12 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) Contact Plating, 12 Circuits, Lead-free, High Barrier Packaging
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| File Size |
523.95K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54121-108051600LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1371
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 13 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 13 CircuitsLead-free, High Barrier Packaging
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| File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
90516-025LF
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| Description |
Minitek® 2.00mm, Board to Board, Unshrouded Right Angled Header,Through Hole, Double Row, 40 Positions, 2.00mm (0.079in) Pitch..
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| Tech specs |
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Official Product Page
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Molex, Inc.
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| Part No. |
15-83-0516
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| Description |
Connector; No. of Contacts:16; Pitch Spacing:0.05"; No. of Rows:1; Mounting Type:Cable; Gender:Plug 16 CONTACT(S), MALE, TELECOM AND DATACOM CONNECTOR, IDC, PLUG
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| File Size |
84.68K /
1 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54101-G0516LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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