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Harwin PLC
HARWIN INC
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| Part No. |
D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922-46
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| Description |
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 40-way DIP40, IC SOCKET
DIP22, IC SOCKET
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| File Size |
238.38K /
1 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
972-402J-G0H
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| Description |
XCede HD2, 4-Pair, 6 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-401E-G0H
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| Description |
XCede HD2, 4-Pair, 6 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-402C-G0H
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| Description |
XCede HD2, 4-Pair, 4 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-402E-G0H
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| Description |
XCede HD2, 4-Pair, 8 Column, Open Wall, Without Extra Ground, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-401C-G0H
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| Description |
XCede HD2, 4-Pair, 8 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
972-401J-G0H
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| Description |
XCede HD2, 4-Pair, 4 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67997-240HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67997-242HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67997-244HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67997-246HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch
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Official Product Page
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Bom2Buy.com
Price and Availability
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