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  44067-1203 Datasheet PDF File

For 44067-1203 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    44067-1202 0440671202

Molex Electronics Ltd.
Part No. 44067-1202 0440671202
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 75970-120-30LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    44067-1801 0440671801

Molex Electronics Ltd.
Part No. 44067-1801 0440671801
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating

File Size 203.94K  /  3 Page

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Amphenol Communications Solutions

Part No. 10018783-11203TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    44067-1201 0440671201

Molex Electronics Ltd.
Part No. 44067-1201 0440671201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating

File Size 204.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 51700-10301203AALF
Description PwrBlade®, Power Supply Connectors, 3P 12S 3P STB Vertical Header.
Tech specs    

Official Product Page

    0440671003 44067-1003

Molex Electronics Ltd.
Part No. 0440671003 44067-1003
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 68771-203HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0440672402 44067-2402

Molex Electronics Ltd.
Part No. 0440672402 44067-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10120300-110-102LF
Description Receptacle, 4 Pair, 5 Column, 9mm Height, 85Ω, Without Damper, Lead Free
Tech specs    

Official Product Page

    44067-0201 0440670201

Molex Electronics Ltd.
Part No. 44067-0201 0440670201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.09K  /  3 Page

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Amphenol Communications Solutions

Part No. U79A1K12031
Description XFP CAGE HS WO REAR GSKT
Tech specs    

Official Product Page

    44067-0802 0440670802

Molex Electronics Ltd.
Part No. 44067-0802 0440670802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 51764-10301203C0LF
Description PwrBlade®, Power Connectors, 3P 12S 3P Right Angle Receptacle, Press Fit
Tech specs    

Official Product Page

    0440672403 44067-2403

Molex Electronics Ltd.
Part No. 0440672403 44067-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131931-203ULF
Description Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 3 Positions, 2mm (0.079inch), horizontal.
Tech specs    

Official Product Page

    0440672001 44067-2001

Molex Electronics Ltd.
Part No. 0440672001 44067-2001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 204.09K  /  3 Page

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Amphenol Communications Solutions

Part No. G832MB011203322HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 120 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold Black.
Tech specs    

Official Product Page

    44067-1602 0440671602

Molex Electronics Ltd.
Part No. 44067-1602 0440671602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB

File Size 204.16K  /  3 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 75160-120-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs    

Official Product Page

For 44067-1203 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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