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  44067-1202 Datasheet PDF File

For 44067-1202 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    44067-0201 0440670201

Molex Electronics Ltd.
Part No. 44067-0201 0440670201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size 204.09K  /  3 Page

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Amphenol Communications Solutions
Part No. 10120260-111-202LF
Description Plug, 4 Pair, 5 Column, 6mm Height, 85Ω, With Damper, Lead Free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    44067-0401 0440670401

Molex Electronics Ltd.
Part No. 44067-0401 0440670401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size 204.10K  /  3 Page

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Amphenol Communications Solutions
Part No. 10120260-131-202LF
Description Plug, 4 Pair, 15 Column, 6mm Height, 85Ω, With Damper, Lead Free
Tech specs 　 　

Official Product Page

    44067-0402 0440670402

Molex Electronics Ltd.
Part No. 44067-0402 0440670402
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 76350-120-22LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 22 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    44067-0403 0440670403

Molex Electronics Ltd.
Part No. 44067-0403 0440670403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. G832MC111202122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs 　 　

Official Product Page

    44067-0601 0440670601

Molex Electronics Ltd.
Part No. 44067-0601 0440670601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
File Size 204.10K  /  3 Page

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Amphenol Communications Solutions
Part No. 54242-111202300LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 20 Positions
Tech specs 　 　

Official Product Page

    0440671001 44067-1001

Molex Electronics Ltd.
Part No. 0440671001 44067-1001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
File Size 204.09K  /  3 Page

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Amphenol Communications Solutions
Part No. G832MB131202222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 30u\\ Gold White.
Tech specs 　 　

Official Product Page

    44067-1802 0440671802

Molex Electronics Ltd.
Part No. 44067-1802 0440671802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
File Size 203.99K  /  3 Page

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Amphenol Communications Solutions
Part No. CE1202000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 20 signal pins, Vertical
Tech specs 　 　

Official Product Page

    44067-0603 0440670603

Molex Electronics Ltd.
Part No. 44067-0603 0440670603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 51701-10001202AALF
Description PwrBlade®, Power Supply Connectors, Vertical Header, With Guide Pin 12S 2P
Tech specs 　 　

Official Product Page

    44067-1602 0440671602

Molex Electronics Ltd.
Part No. 44067-1602 0440671602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 74771-202001LF
Description Metral® Board Connectors, Backplane Connectors, 8 Row Signal Header, Straight, Press-Fit, Wide body.
Tech specs 　 　

Official Product Page

    44067-1601 0440671601

Molex Electronics Ltd.
Part No. 44067-1601 0440671601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size 204.11K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-112021300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For 44067-1202 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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