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  44067-1003 Datasheet PDF File

For 44067-1003 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    44067-0403 0440670403

Molex Electronics Ltd.
Part No. 44067-0403 0440670403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
File Size 204.16K  /  3 Page

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Rochester Electronics LLC
Part No. 100324/VYA
Description 100324 - TTL to ECL Translator, 6 Func, Complementary Output, ECL - Dual marked (5962-9153001VYA)
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    44067-0601 0440670601

Molex Electronics Ltd.
Part No. 44067-0601 0440670601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
File Size 204.10K  /  3 Page

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Rochester Electronics LLC
Part No. 100331/VYA
Description 100331 - 100K Series, Low Power Triple D-Type Flip-Flop - Dual marked (5962-9153601VYA) - SPACE-LEVEL LOGIC
Tech specs 　 　

Official Product Page

    44067-0603 0440670603

Molex Electronics Ltd.
Part No. 44067-0603 0440670603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 10035388-912LF
Description Power Card Edge, Power Connectors, 2 x 14P STB Right Angle.
Tech specs 　 　

Official Product Page

    0440672403 44067-2403

Molex Electronics Ltd.
Part No. 0440672403 44067-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 10035388-500
Description Power Card Edge, Power Connectors, 2 x 28P STB Right Angle.
Tech specs 　 　

Official Product Page

    44067-0802 0440670802

Molex Electronics Ltd.
Part No. 44067-0802 0440670802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 10039755-10003TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    44067-1201 0440671201

Molex Electronics Ltd.
Part No. 44067-1201 0440671201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
File Size 204.11K  /  3 Page

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Amphenol Communications Solutions
Part No. 10039755-10012TLF
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    44067-1202 0440671202

Molex Electronics Ltd.
Part No. 44067-1202 0440671202
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 10034908-007LF
Description Power Card Edge, Power Connectors, 2 x 17P Straddle Mount.
Tech specs 　 　

Official Product Page

    44067-1203 0440671203

Molex Electronics Ltd.
Part No. 44067-1203 0440671203
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
File Size 204.16K  /  3 Page

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Amphenol Communications Solutions
Part No. 10035388-000LF
Description Power Card Edge, Power Connectors, 2 x 29P STB Right Angle.
Tech specs 　 　

Official Product Page

    44067-1601 0440671601

Molex Electronics Ltd.
Part No. 44067-1601 0440671601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size 204.11K  /  3 Page

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Amphenol Communications Solutions
Part No. 10035388-909LF
Description Power Card Edge, Power Connectors, 2 x 17P STB Right Angle.
Tech specs 　 　

Official Product Page

    MOLEX INC
Part No. 0440671401
Description 14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
File Size 29.77K  /  2 Page

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Amphenol Communications Solutions
Part No. 10036767-10200TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical Card Edge Connector, 36 Positions, 1mm (0.039inch) Pitch .
Tech specs 　 　

Official Product Page

For 44067-1003 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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