44067-1001 pdf Datasheet P2 Part Num --- IC-ON-LINE

Amphenol Cables on Demand

Part No.

SF-NDYYYF0001-001M_Group

Description

Amphenol SF-NDYYYF0001-001M 1m (3.3') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD

Tech specs

Official Product Page

44067-1001 Datasheet PDF File

For 44067-1001 Found Datasheets File :: 150+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

				Molex Electronics Ltd.
Part No.	44067-1201 0440671201
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, Tin (Sn) Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
File Size	204.11K / 3 Page	View it Online	Download Datasheet

				MOLEX INC
Part No.	0440671401
Description	14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
File Size	29.77K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1202 0440671202
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-1203 0440671203
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0802 0440670802
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0603 0440670603
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				MOLEX INC
Part No.	0440670403
Description	4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
File Size	29.79K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0601 0440670601
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 6 Circuits, Tin (Sn) Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
File Size	204.10K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0403 0440670403
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	44067-0402 0440670402
Description	3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB 3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
File Size	204.16K / 3 Page	View it Online	Download Datasheet

For 44067-1001 Found Datasheets File :: 150+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |