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  43045-0225 Datasheet PDF File

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    43045-0610

Molex Electronics Ltd.
Part No. 43045-0610
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-0410

Molex Electronics Ltd.
Part No. 43045-0410
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 4 Circuits
File Size 180.68K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-0800

Molex Electronics Ltd.
Part No. 43045-0800
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits
File Size 190.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 68602-256HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 56 Positions, 2.54 mm (0.100in)Pitch.
Tech specs 　 　

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.78K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-102-25LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0806

Molex Electronics Ltd.
Part No. 43045-0806
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 57102-F02-25LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions
Tech specs 　 　

Official Product Page

    43045-0807

Molex Electronics Ltd.
Part No. 43045-0807
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 54242-411202250LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    43045-0808

Molex Electronics Ltd.
Part No. 43045-0808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 8 Circuits
File Size 184.25K  /  3 Page

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Amphenol Communications Solutions
Part No. 7432E0225S01LF
Description Smart Card Reader, Input Output Connectors, Connectors for Vandalism Proof, 8 contacts, Durability Environment, TMT Lead Free.
Tech specs 　 　

Official Product Page

    43045-0809

Molex Electronics Ltd.
Part No. 43045-0809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 180.46K  /  3 Page

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Amphenol Communications Solutions
Part No. 7361E0225S16LF
Description Smart Card Reader, Input Output Connectors, Connectors for Vandalism Proof, 8 contacts, Durability Environment, Lead Free
Tech specs 　 　

Official Product Page

    43045-0810

Molex Electronics Ltd.
Part No. 43045-0810
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 8 Circuits
File Size 180.50K  /  3 Page

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Amphenol Communications Solutions
Part No. 7361E0225S17LF
Description Smart Card Reader, Input Output Connectors, Connectors for Vandalism Proof, 8 cts, Durability Environment, Lead Free.
Tech specs 　 　

Official Product Page

    43045-0820

Molex Electronics Ltd.
Part No. 43045-0820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 8 Circuits
File Size 174.46K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-802-25LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

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