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  0034.5133 Datasheet PDF File

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    14-60-0034

Molex Electronics Ltd.
Part No. 14-60-0034
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 26, 3.81μm (150μ) Tin/Lead (SnPb),3 Circuits

File Size 165.55K  /  3 Page

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Amphenol Communications Solutions

Part No. 87185-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    BL-B5133N

BRIGHT LED ELECTRONICS CORP
Part No. BL-B5133N
Description Chip material: GaP/GaP

File Size 126.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    New Jersey Semi-Conductor Products, Inc.
Part No. 2N5133
Description PHYSICAL DIMENSIONS

File Size 123.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 98426-S04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    ATS-51330D-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-51330D-C2-R0
Description Ultra High Performance BGA Cooling

File Size 267.01K  /  1 Page

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Amphenol Communications Solutions

Part No. 68655-133HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
Tech specs    

Official Product Page

    ATS-51330K-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-51330K-C2-R0
Description Ultra High Performance BGA Cooling

File Size 267.01K  /  1 Page

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Amphenol Communications Solutions

Part No. 51915-133LF
Description PwrBlade®, Power Connectors, 7P 8S 1ACP 2P Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    ATS-51330R-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-51330R-C2-R0
Description Ultra High Performance BGA Cooling

File Size 267.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 68705-133HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SCHURTER INC
Part No. 0034.5625.21
Description TIME LAG BLOW ELECTRIC FUSE, 6.3A, 250VAC, 10A (IR), SURFACE MOUNT

File Size 376.48K  /  3 Page

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Amphenol Communications Solutions

Part No. 98426-S04-25-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    Schurter, Inc.
Part No. 0034.0911.PT
Description Fuse Misc, Non resettable fuses, Miniature Fuses, Type SA 5x20

File Size 36.41K  /  1 Page

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Amphenol Communications Solutions

Part No. 77315-133-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

   
Part No. 70034
Description From old datasheet system

File Size 112.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 93235-133LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Straight, Solder-to-Board, LF.
Tech specs    

Official Product Page

    SI-70034

Bel Fuse Inc.
Part No. SI-70034
Description SI-70034

File Size 280.73K  /  4 Page

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Amphenol Communications Solutions

Part No. 68015-133HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 33 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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