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substrates. Datasheet PDF File

For substrates. Found Datasheets File :: 1329 Search Time::5.078ms
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				Hittite Microwave Corporation
Part No.	HMC975
OCR Text	...il) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). i f 0 .254mm (10 mil) thick alumina thin flm substrates must be used, the die should be raised 0.150mm (6 mils) so th...
Description	PIN MMIC HIGH ISOLATION SPDT SWITCH, 2 - 50 GHz
File Size	285.23K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC971
OCR Text	...il) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin flm substrates must be used, the die should be raised 0.150mm (6 mils) so that...
Description	PIN MMIC HIGH ISOLATION SPDT SWITCH, 18 - 40 GHz
File Size	344.00K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC970
OCR Text	...il) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). i f 0.254mm (10 mil) thick alumina thin flm substrates must be used, the die should be raised 0.150mm (6 mils) so tha...
Description	2 WATT PIN MMIC HIGH ISOLATION SPDT SWITCH, 8 - 21 GHz
File Size	306.67K / 6 Page	View it Online	Download Datasheet

				M/A-COM Technology Solu... M/A-COM Technology Solutions, Inc.
Part No.	MA4E2514M-1116 MA4E2514M-1116T MA4E2514M-1116W MADS-002514-1116LP MADS-002514-1116MP MA4E2514L-1116 MA4E2514L-1116T MA4E2514L-1116W
OCR Text	... Model Die Bonding For Hard substrates, we recommend utilizing a vacuum tip and force of 60 to 100 grams applied uniformly to the top surface of the device, using a hot gas bonder with equal heat applied across the bottom mounting pads ...
Description	SURMOUNTTM Low and Medium Barrier Silicon Schottky Diodes: Tee Pair
File Size	95.19K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC637
OCR Text	... mil) thick alumina thin flm substrates are recommended for bringing rf to and from the chip ( f igure 1). i f 0.254mm (10 mil) thick alumina thin flm substrates must be used, the die should be raised 0.150mm (6 mils) so...
Description	GaAs MESFET MMIC 1 WATT POWER AMPLIFIER, DC - 6 GHz
File Size	328.85K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC52409
OCR Text	...(5 mil) thick alumina thin lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface ...
Description	GaAs MMIC I/Q MIXER 22 - 32 GHz
File Size	230.52K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC383
OCR Text	...(5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface o...
Description	GAAS PHEMT MMIC MEDIUM POWER AMPLIFIER, 12 - 30 GHZ
File Size	329.93K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC52309
OCR Text	...(5 mil) thick alumina thin lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface ...
Description	GaAs MMIC I/Q MIXER 15 - 23.6 GHz
File Size	245.04K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC52209
OCR Text	...(5 mil) thick alumina thin lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface ...
Description	GaAs MMIC I/Q MIXER 11 - 16 GHz
File Size	232.54K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC52010
OCR Text	...(5 mil) thick alumina thin lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface ...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	237.80K / 6 Page	View it Online	Download Datasheet

For substrates. Found Datasheets File :: 1329 Search Time::5.078ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |