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  SMV1213-004 Datasheet PDF File

For SMV1213-004 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    705-51-0047

Molex Electronics Ltd.
Part No. 705-51-0047
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .120 Pocket, Shroudedwith Beveled Plastic Peg, 13 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin

File Size 299.76K  /  4 Page

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HUA FENG CIRCUIT





    HMC-C004

Hittite Microwave Corporation
Part No. HMC-C004
Description WIDEBAND DRIVER AMPLIFIER MODULE, 10 MHz - 20 GHz

File Size 357.77K  /  6 Page

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    MOLEX INC
Part No. 051-26-0041
Description 96 CONTACT(S), FEMALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, RECEPTACLE

File Size 135.65K  /  2 Page

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Part No. 460-0040-01
Description BOX SEALED DIECAST

File Size 44.76K  /  1 Page

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    Agilent(Hewlett-Packard...
Part No. MR-0040.008
Description FAP MASTR

File Size 804.48K  /  2 Page

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    CGM-18-2004

Teledyne Technologies Incorporated
Part No. CGM-18-2004
Description Module Amplifier 2 GHz - 18 GHz

File Size 903.32K  /  2 Page

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    CGM-18-6004

Teledyne Technologies Incorporated
Part No. CGM-18-6004
Description Module Amplifier 6 GHz - 18 GHz

File Size 903.33K  /  2 Page

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    701-07-0046

Molex Electronics Ltd.
Part No. 701-07-0046
Description 2.54mm (.100) Pitch SL Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B, With Mounting Ears, 12 Circuits

File Size 166.85K  /  4 Page

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    701-07-0045

Molex Electronics Ltd.
Part No. 701-07-0045
Description 2.54mm (.100) Pitch SL Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B, With Mounting Ears, 11 Circuits

File Size 166.85K  /  4 Page

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    TGM-18-2004

Teledyne Technologies Incorporated
Part No. TGM-18-2004
Description MODULE AMPLIFIER 2 GHZ - 18 GHZ

File Size 891.16K  /  2 Page

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For SMV1213-004 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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