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  LXAC-1850 Datasheet PDF File

For LXAC-1850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    0015446860 71850-0093

Molex Electronics Ltd.
Part No. 0015446860 71850-0093
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 60 Circuits

File Size 372.59K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-409481850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015446868 71850-0097

Molex Electronics Ltd.
Part No. 0015446868 71850-0097
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile,Vertical, High-Temperature, 68 Circuits

File Size 364.89K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015446864 71850-0095 A-71850-0095

Molex Electronics Ltd.
Part No. 0015446864 71850-0095 A-71850-0095
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 64 Circuits

File Size 372.59K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-809241850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71850-0068 A-71850-0068 0015446810

Molex Electronics Ltd.
Part No. 71850-0068 A-71850-0068 0015446810
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 10 Circuits
2.54mm (.100") Pitch C-Grid庐 Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 10 Circuits
2.54mm (.100") Pitch C-Grid垄莽 Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 10 Circuits

File Size 372.89K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5045LF
Description SFP+ Cable Assembly, 24 AWG, 4.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    LAN83C185 LAN83C18503

SMSC Corporation
Part No. LAN83C185 LAN83C18503
Description High Performance Single Chip Low Power 10/100 Ethernet Physical Layer Transceiver

File Size 439.12K  /  65 Page

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Amphenol Communications Solutions

Part No. 10110818-5095LF
Description SFP+ Cable Assembly, 24 AWG, 9.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    0015446848 71850-0087

Molex Electronics Ltd.
Part No. 0015446848 71850-0087
Description 2.54mm (.100") Pitch C-Grid庐 Receptacle, Through Hole, Dual Row, High Profile,Vertical, High-Temperature, 48 Circuits
2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile,Vertical, High-Temperature, 48 Circuits

File Size 372.59K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5050HFLF
Description SFP+ Cable Assembly, 24 AWG, 5.0 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    71850-0067 A-71850-0067 0015446808 15-44-6808

Molex Electronics Ltd.
Part No. 71850-0067 A-71850-0067 0015446808 15-44-6808
Description 2.54mm (.100") Pitch C-Grid庐 Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 8 Circuits
2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 8 Circuits

File Size 372.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-110161850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71850-0069 A-71850-0069 0015446812

Molex Electronics Ltd.
Part No. 71850-0069 A-71850-0069 0015446812
Description 2.54mm (.100") Pitch C-Grid庐 Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 12 Circuits
2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 12 Circuits

File Size 372.59K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-185-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs    

Official Product Page

    71850-0071 A-71850-0071 0015446816

Molex Electronics Ltd.
Part No. 71850-0071 A-71850-0071 0015446816
Description 2.54mm (.100") Pitch C-Grid庐 Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 16 Circuits
2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 16 Circuits

File Size 372.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109481850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71850-0072 A-71850-0072 0015446818

Molex Electronics Ltd.
Part No. 71850-0072 A-71850-0072 0015446818
Description 2.54mm (.100") Pitch C-Grid庐 Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 18 Circuits
2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row, High Profile, Vertical, High-Temperature, 18 Circuits

File Size 372.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 10110818-5015LF
Description SFP+ Cable Assembly, 24 AWG, 1.5 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

For LXAC-1850 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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