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				NEC Corp.
Part No.	UPC1251GR5-9LG-E1-A UPC1251GR5-9LG-E2-A UPC1251GR-9LG UPC1251GR-9LG-E1-A UPC1251GR-9LG-E2-A UPC1251MP5-KAA-E1-A UPC1251MP5-KAA-E2-A UPC1251MP-KAA UPC1251MP-KAA-E1-A UPC1251MP-KAA-E2-A UPC358GR5-9LG-E1-A UPC358GR5-9LG-E2-A UPC358GR-9LG UPC358GR-9LG-E1-A UPC358GR-9LG-E2-A
OCR Text	...ly one side is copper foiled is filling wired) is mounted. Note that restrictions will be made to the following conditions for each product, and the derating ratio depending on the operating ambient temperature. PC1251GR-9LG: Derate at ...
Description	BIPOLAR ANALOG INTEGRATED CIRCUIT SINGLE POWER SUPPLY DUAL OPERATIONAL AMPLIFIERS
File Size	221.56K / 12 Page	View it Online	Download Datasheet

				NEC, Corp. NEC Corp.
Part No.	UPC177GR5-9LG-E1-A UPC177GR5-9LG-E2-A UPC177GR-9LG UPC177GR-9LG-E1-A UPC177GR-9LG-E2-A UPC339GR-9LG UPC339GR-9LG-E1-A UPC339GR-9LG-E2-A UPC339GR5-9LG-E1-A UPC339GR5-9LG-E2-A
OCR Text	...ly one side is copper foiled is filling wired) is mounted. Note that restrictions will be made to the following conditions for each product, and the derating ratio depending on the operating ambient temperature. PC177GR-9LG: Derate at -...
Description	BIPOLAR ANALOG INTEGRATED CIRCUIT SINGLE POWER SUPPLY QUAD COMPARATORS 双极模拟集成电路单电源供电四比较
File Size	191.60K / 10 Page	View it Online	Download Datasheet

				NEC, Corp. NEC Corp.
Part No.	UPC393GR5-9LG-E1-A UPC393GR5-9LG-E2-A UPC393GR-9LG UPC393GR-9LG-E1-A UPC393GR-9LG-E2-A UPC277MP-KAA UPC277MP-KAA-E1-A UPC277MP-KAA-E2-A UPC277GR-9LG-E1-A UPC277MP5-KAA-E1-A UPC277MP5-KAA-E2-A UPC277GR5-9LG-E1-A UPC277GR5-9LG-E2-A UPC277GR-9LG UPC277GR-9LG-E2-A
OCR Text	...ly one side is copper foiled is filling wired) is mounted. Note that restrictions will be made to the following conditions for each product, and the derating ratio depending on the operating ambient temperature. PC277GR-9LG: Derate at -...
Description	BIPOLAR ANALOG INTEGRATED CIRCUIT SINGLE POWER SUPPLY DUAL COMPARATORS WITH SMALL PACKAGE 双极模拟集成电路单电源双路比较小包装
File Size	208.51K / 12 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	AN-5061
OCR Text	...he interplane capacitance. When filling signal planes with copper, it is important to remember to relieve the copper fill back at least five times the distance from the trace to the nearest return plane (Y=5H). The trace impedance is compro...
Description	Layout Guidelines
File Size	126.02K / 4 Page	View it Online	Download Datasheet

				NEC
Part No.	UPC842GR-9LG-E2-A UPC842GR-9LG-E1-A UPC4742GR-9LG-E1-A UPC4742GR-9LG-E2-A UPC842GR-9LG
OCR Text	...ly one side is copper foiled is filling wired) is mounted. Note that restrictions will be made to the following conditions for each product, and the derating ratio depending on the operating ambient temperature. PC842GR-9LG: Derate at -...
Description	BIPOLAR ANALOG INTEGRATED CIRCUIT SINGLE POWER SUPPLY, HIGH SPEED, WIDE BAND, DUAL OPERATIONAL AMPLIFIERS
File Size	199.31K / 10 Page	View it Online	Download Datasheet

				NEC
Part No.	UPC844GR-9LG-E2-A UPC844GR-9LG-E1-A UPC4744GR-9LG UPC4744GR-9LG-E1-A UPC4744GR-9LG-E2-A UPC844GR-9LG
OCR Text	...ly one side is copper foiled is filling wired) is mounted. Note that restrictions will be made to the following conditions for each product, and the derating ratio depending on the operating ambient temperature. PC844GR-9LG: Derate at -...
Description	BIPOLAR ANALOG INTEGRATED CIRCUIT SINGLE POWER SUPPLY, HIGH SPEED, WIDE BAND, QUAD OPERATIONAL AMPLIFIERS
File Size	200.23K / 10 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors
Part No.	CHX2090-QDG
OCR Text	...for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a grid of via's ...
Description	12-24GHz Frequency Multiplier
File Size	319.74K / 10 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors
Part No.	CHA6664-QDG
OCR Text	...for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a grid of via's ...
Description	12-16GHz 1W High Power Amplifier
File Size	321.31K / 10 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors
Part No.	CHT3091AQAG
OCR Text	...for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a grid of via's ...
Description	DC-12GHz ATTENUATOR
File Size	318.68K / 6 Page	View it Online	Download Datasheet

For filling Found Datasheets File :: 427 Search Time::1.422ms
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