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  DD12.1621.111 Datasheet PDF File

For DD12.1621.111 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    Red Lion Controls. Inc
Part No. T1621100
Description MODELS T16 & P16 - TEMPERATURE/PROCESS CONTROLLERS
File Size 1,736.35K  /  28 Page

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Amphenol Communications Solutions
Part No. 131-6216-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    DSP16210

AGERE[Agere Systems]
Part No. DSP16210
Description DSP16210 Digital Signal Processor
File Size 1,296.75K  /  173 Page

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Amphenol Communications Solutions
Part No. 131-6216-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

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    MAXIM INTEGRATED PRODUCTS INC
Part No. DS1621S/TAMPR
Description DIGITAL TEMP SENSOR-SERIAL, 9BIT(s), 2Cel, RECTANGULAR, SURFACE MOUNT
File Size 300.96K  /  18 Page

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Amphenol Communications Solutions
Part No. 20021621-00026D8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 26 contacts
Tech specs 　 　

Official Product Page

    HT162105 HT1621

Holtek Semiconductor Inc
Part No. HT162105 HT1621
Description RAM Mapping 32x4 LCD Controller for I/O MCU
File Size 189.30K  /  19 Page

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Amphenol Communications Solutions
Part No. 20021621-00044T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 44 contacts
Tech specs 　 　

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    GS816218

GSI Technology
Part No. GS816218
Description (GS816218 / GS816236BB) S/DCD Sync Burst SRAMs
File Size 622.68K  /  31 Page

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Amphenol Communications Solutions
Part No. 20021621-00014T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 14 contacts
Tech specs 　 　

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    HT162109 HT1621

Holtek Semiconductor Inc
Part No. HT162109 HT1621
Description RAM Mapping 324 LCD Controller for I/O MCU
File Size 188.25K  /  21 Page

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Amphenol Communications Solutions
Part No. 10132449-1621GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 16 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

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    MJW16212

Motorola Mobility Holdings, Inc.
MOTOROLA[Motorola, Inc]
http://
Part No. MJW16212
Description POWER TRANSISTOR 10 AMPERES 1500 VOLTS - VCES 50 AND 150 WATTS 10 A, 650 V, NPN, Si, POWER TRANSISTOR, TO-247AE
File Size 290.79K  /  8 Page

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Amphenol Communications Solutions
Part No. 86130162113365E1LF
Description 8613 M LF CNR
Tech specs 　 　

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    Oriole
Part No. ODM16216
Description LCD Module
File Size 54.99K  /  1 Page

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Amphenol Communications Solutions
Part No. 20021621-00060T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 60 contacts
Tech specs 　 　

Official Product Page

    Teledyne Technologies I...
Part No. IQM11621
Description    6.0 TO 10.8 GHz IQ MIXER MODULATOR/DEMODULATOR
File Size 230.75K  /  2 Page

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Amphenol Communications Solutions
Part No. 20021621-00044D1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 44 contacts
Tech specs 　 　

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    Semiconductor Technology Inc
Part No. MJW16212
Description BJT - Datasheet Reference
From old datasheet system
File Size 28.39K  /  2 Page

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Amphenol Communications Solutions
Part No. 20021621-00034D4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 34 contacts
Tech specs 　 　

Official Product Page

For DD12.1621.111 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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