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  base-potted Datasheet PDF File

For base-potted Found Datasheets File :: 239    Search Time::2.437ms    
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    B82442H1273K000 B82442H1275000 B82442H1155000 B82442H1272K000 B82442H1274000 B82442H1685000 B82442H1332K000 B82442H13330

EPCOS
Part No. B82442H1273K000 B82442H1275000 B82442H1155000 B82442H1272K000 B82442H1274000 B82442H1685000 B82442H1332K000 B82442H1333000 B82442H1334000 B82442H1335000 B82442H1392K000 B82442H1393000 B82442H1394000 B82442H1395000 B82442H1822K000 B82442H1823000 B82442H1824000 B82442H1825000 B82442H1102K000 B82442H1103K000 B82442H1104000 B82442H1105000 B82442H1106000 B82442H1122K000 B82442H1123K000 B82442H1124000 B82442H1125000 B82442H1222K000 B82442H1223K000 B82442H1224000 B82442H1225000 B82442H1153K000 B82442H1472K000 B82442H1473000 B82442H1474000 B82442H1475000 B82442H1684000 B82442H1562K000 B82442H1563000 B82442H1564000 B82442H1565000 B82442H1152K000 B82442H1154000 B82442H1182K000 B82442H1183K000 B82442H1184000 B82442H1185000
OCR Text ...rial electronics Terminals Base material CuSn6 Layer composition Cu, Ag, Sn (lead-free)1) Electro-plated Marking Marking on comp...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description SMT inductors

File Size 155.32K  /  9 Page

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    B82464G4102M000 B82464G4103M000 B82464G4104M000 B82464G4105M000 B82464G4472M000 B82464G4473M000 B82464G4474M000 B82464G4

EPCOS
Part No. B82464G4102M000 B82464G4103M000 B82464G4104M000 B82464G4105M000 B82464G4472M000 B82464G4473M000 B82464G4474M000 B82464G4152M000 B82464G4153M000 B82464G4154M000 B82464G4332M000 B82464G4333M000 B82464G4334M000 B82464G4821M000 B82464G4683M000
OCR Text ...rial electronics Terminals Base material CuFe2P Layer composition Ag, Sn (lead-free) Electro-plated Marking Marking on component...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description SMT power inductors

File Size 172.96K  /  8 Page

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    B82720S10 B82720S2202N040 B82720-S2102-N40 B82720-S2601-N40 B82720S2601N040

EPCOS AG
Part No. B82720S10 B82720S2202N040 B82720-S2102-N40 B82720-S2601-N40 B82720S2601N040
OCR Text ...e power supplies Terminals Base material CuSn6 Layer composition Ni, Sn Hot-dipped Marking Marking on component: Manufacturer...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description    Power line chokes
1 ELEMENT, 1100 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 3000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 4400 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 480.54K  /  8 Page

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    B82131A5301M000 B82131A5302M000 B82131 B82131A5151M000 B82131A5151M00008 B82131A5152M000 B82131A5202M000 B82131A5401M000

EPCOS AG
Part No. B82131A5301M000 B82131A5302M000 B82131 B82131A5151M000 B82131A5151M00008 B82131A5152M000 B82131A5202M000 B82131A5401M000 B82131A5402M000 B82131A5701M000 B82132 B82132A5151M000 B82132A5152M000 B82132A5202M000 B82132A5301M000 B82134A5152M000 B82133 B82131-A5402-M
OCR Text ...erminals Central axial leads Base material Cu Hot-dip tinned with pure tin Marking LR and IR in clear text Delivery mode and packing ...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description Inductors
1 ELEMENT, 1 uH, CARBONYL IRON-CORE, GENERAL PURPOSE INDUCTOR

File Size 127.12K  /  9 Page

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    B82477G2332M000 B82477G2333M000 B82477G2334M000 B82477G2102M000 B82477G2223M000 B82477G2154M000 B82477G2104M000 B82477G2

EPCOS
Part No. B82477G2332M000 B82477G2333M000 B82477G2334M000 B82477G2102M000 B82477G2223M000 B82477G2154M000 B82477G2104M000 B82477G2105M000 B82477G2103M000 B82477G2123M000 B82477G2132M000 B82477G2153M000 B82477G2222M000 B82477G2224M000 B82477G2472M000 B82477G2473M000 B82477G2474M000 B82477G2682M000 B82477G2683M000 B82477G2684M000 B82477G2752M000
OCR Text ...umer electronics Terminals Base material Cu (L 10 H), CuSn6P (L 15 H) Layer composition Ni, Sn (lead-free) Electro-plated Markin...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description SMT power inductors

File Size 151.29K  /  7 Page

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    B82469G1911M000 B82469G1152M000 B82469G1153M000 B82469G1332M000 B82469G1 B82469G1222M000 B82469G1103M000 B82469G1223M000

EPCOS
Part No. B82469G1911M000 B82469G1152M000 B82469G1153M000 B82469G1332M000 B82469G1 B82469G1222M000 B82469G1103M000 B82469G1223M000 B82469G1682M000
OCR Text ...umer electronics Terminals Base material CuSn6P Layer composition Ni, Sn (lead-free) Electro-plated Marking Marking on component...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description SMT power inductors

File Size 84.23K  /  7 Page

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    B82145A1334J000 B82145A1104J000 B82145A1105J000 B82145A1106J000 B82145A1154J000 B82145A1155J000 B82145A1224J000 B82145A1

EPCOS
Part No. B82145A1334J000 B82145A1104J000 B82145A1105J000 B82145A1106J000 B82145A1154J000 B82145A1155J000 B82145A1224J000 B82145A1474J000 B82145A1335J000 B82145A1685J000 B82145A1225J000 B82145A1475J000 B82145A1684J000
OCR Text ...erminals Central axial leads Base material CuAg0.1 Hot-dipped with pure tin Marking Inductance indicated by color bands to IEC 60062 ...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description Inductors

File Size 144.27K  /  8 Page

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    B82791H2901N020 B82791G2401N001 B82791H2251N020 B82791H2301N001 B82791H2351N001 B82791H2401N001 B82791H2501N001 B82791H2

EPCOS AG
Part No. B82791H2901N020 B82791G2401N001 B82791H2251N020 B82791H2301N001 B82791H2351N001 B82791H2401N001 B82791H2501N001 B82791H2601N001 B82791H2701N001 B82791G2251N020 B82791G2301N001 B82791G2351N001 B82791G2501N001 B82791G2601N001 B82791G2701N001
OCR Text ... supplies Terminals Base material CuNi18Zn20 Layer composition Ni, Sn Hot-dipped Pins 0.6 mm Lead spacing 10 x 15 (mm) or 12.7 ...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description 1 ELEMENT, 15000 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR
Power line chokes

File Size 135.88K  /  7 Page

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    B82793C2113N201 B82793C2113N20108 B82793C2225N265 B82793C2473N201 B82793C2474N215

EPCOS
Part No. B82793C2113N201 B82793C2113N20108 B82793C2225N265 B82793C2473N201 B82793C2474N215
OCR Text ...ns ISDN systems Terminals Base material CuSn6 Layer composition Ni, Sn Hot-dipped Marking Marking on component: Manufacturer...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description Data and signal line chokes

File Size 176.08K  /  8 Page

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    B82796C2113N201 B82796C2473N201 B82796C2225N265 B82796C2474N215

EPCOS
EPCOS AG
Part No. B82796C2113N201 B82796C2473N201 B82796C2225N265 B82796C2474N215
OCR Text ...n pass unaffectedly Terminals Base material CuNi18Zn20 Layer composition Ni, Sn Hot-dipped Marking Manufacturer, ordering code, date ...potted in customer applications: - Many potting materials shrink as they harden. They therefore e...
Description Data and signal line chokes
4 ELEMENT, 47 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR

File Size 99.64K  /  7 Page

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For base-potted Found Datasheets File :: 239    Search Time::2.437ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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