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Texas Instruments |
| Part No. |
8101602EA
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| Description |
CMOS Presettable Up/Down Counter 16-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
8101801EA
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| Description |
CMOS Triple 2-Channel Analog Multiplexer/Demultiplexer with Logic-Level Conversion 16-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
8101701EA
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| Description |
CMOS 4-Stage Parallel In/Parallel Out Shift Register 16-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75168-101-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10114828-10102LF
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| Description |
1.25mm Wire to Board Wafer,Vertical, Surface Mount, 2 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-101B24LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73810-1207 0738101207
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079) Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
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| File Size |
164.68K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
95278-101B22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131318-1012100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 10 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73810-1206 0738101206
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
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| File Size |
164.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10131318-10111G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 10 Positions, GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-101-36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Price and Availability
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